Common Test Cases Sharing

Test Content:

Open cover test, also known as DECAP, is a destructive experiment that uses a chemical reagent method or laser etching to remove the external packaging shell of the component to check the presence of internal wafers, the size of the wafer, the manufacturer's logo, the copyright year, the wafer code, and can determine the authenticity of the chip.

Inspection Purpose:

Verify the authenticity of the chip and failure analysis, etc.

Commonly Used Equipment:

Generally speaking, there are chemical (Chemical) unsealing, mechanical (Mechanical) unsealing, laser (Laser) unsealing, PlasmaDecap, etc.

Caution:

All operations should be performed in a fume hood and acid-proof gloves should be worn.

The more the product is opened, the less acid there is and should be cleaned periodically to avoid excessive corrosion.

During the cleaning process, take care that the tweezers do not touch the gold wire and chip surface to avoid rubbing on the chip and gold wire.

In some cases it is necessary to line up and re-test the product that has been opened and capped. This should first be observed under the microscope 80 times to observe whether the gold wire on the chip is broken, collapsed wire, if not, then use the blade to scrape the black film on the pin before sending it for testing.

Pay attention to control the opening temperature of the cover is not too high.