Specification Comparison: K6X1008C2D-GF70 vs K6X1008C2D-BF55 vs K6X1008T2D-BF70
Hide identical items
All
Part Number
|
|
|
|
---|---|---|---|
Manufacturer | SAMSUNG | SAMSUNG | SAMSUNG |
Package | SOP-32 | SOP-32 | SOP-32 |
Description | SRAM chip, 128KX8, 70ns, CMOS | Standard SRAM, 128KX8, 55ns, CMOS, PDSO32 | Standard SRAM, 128KX8, 70ns, CMOS, PDSO32 |
Stock | 4853 | 4456 | 3973 |
Rohs Code | No | Yes | |
Part Life Cycle Code | Obsolete | Obsolete | |
ECCN Code | EAR99 | EAR99 | |
HTS Code | 8542.32.00.41 | 8542.32.00.41 | |
Access Time-Max | 70 ns | 70 ns | |
I/O Type | COMMON | COMMON | |
JESD-30 Code | R-PDSO-G32 | R-PDSO-G32 | |
Memory Density | 1048576 bit | 1048576 bit | |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | |
Memory Width | 8 | 8 | |
Moisture Sensitivity Level | 3 | 3 | |
Number of Terminals | 32 | 32 | |
Number of Words | 131072 words | 131072 words | |
Number of Words Code | 128000 | 128000 | |
Operating Mode | ASYNCHRONOUS | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | 85 °C | |
Operating Temperature-Min | -40 °C | -40 °C | |
Organization | 128KX8 | 128KX8 | |
Output Characteristics | 3-STATE | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | |
Package Code | SOP | SOP | |
Package Equivalence Code | SOP32,.56 | SOP32,.56 | |
Package Shape | RECTANGULAR | RECTANGULAR | |
Package Style | SMALL OUTLINE | SMALL OUTLINE | |
Parallel/Serial | PARALLEL | PARALLEL | |
Peak Reflow Temperature (Cel) | 240 | 260 | |
Power Supplies | 5 V | 3/3.3 V | |
Qualification Status | Not Qualified | Not Qualified | |
Standby Voltage-Min | 2 V | 2 V | |
Supply Current-Max | 0.025 mA | 0.02 mA | |
Surface Mount | YES | YES | |
Technology | CMOS | CMOS | |
Temperature Grade | INDUSTRIAL | INDUSTRIAL | |
Terminal Form | GULL WING | GULL WING | |
Terminal Pitch | 1.27 mm | 1.27 mm | |
Terminal Position | DUAL | DUAL | |
Part Package Code | SOIC | ||
Pin Count | 32 | ||
JESD-609 Code | e0 | ||
Length | 20.47 mm | ||
Number of Functions | 1 | ||
Seated Height-Max | 3 mm | ||
Standby Current-Max | 0.00001 A | ||
Supply Voltage-Max (Vsup) | 5.5 V | ||
Supply Voltage-Min (Vsup) | 4.5 V | ||
Supply Voltage-Nom (Vsup) | 5 V | ||
Terminal Finish | Tin/Lead (Sn/Pb) | ||
Time@Peak Reflow Temperature-Max (s) | 30 | ||
Width | 11.43 mm | ||
Product Category | IC Chips |
Part Number
Start with: K6X10
Part Number "K6X10" returned 20 results; all results matched and started with "K6X10".
Part Number | Description | Brand | Package/Case | Lifecycle Status | Cargo cycle | In Stock | Operation |
---|---|---|---|---|---|---|---|
K6X1008C2D-TF55 |
55ns Static RAM |
Samsung Semiconductor, Inc. | 32-TSOP REVERSE | 3~7 Days | 7,101.00 | ||
K6X1008C2D-GF55 |
Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 |
SAMSUNG | SOP-32 | 3~7 Days | 5,129.00 | ||
K6X1008C2D-PF55000 |
Ultra-fast 128K x 8 synchronous SRAM chip for high-speed processing (93 characters) |
Samsung Electronics | TSOP-I | 3~7 Days | 3,446.00 | ||
K6X1008C1D-BF55T |
|
SAMSUNG | 3~7 Days | 4,558.00 | |||
K6X1008C1D-GB55 |
|
SAMSUNG | SOP32 | 3~7 Days | 18,000.00 | ||
K6X1008C1D-PF70 |
|
SAMSUNG | 3~7 Days | 3,000.00 | |||
K6X1008C1D-TF55 |
|
SAMSUNG | TSOP | 3~7 Days | 5,000.00 | ||
K6X1008C1D-TF70 |
|
SAMSUNG | TSOP | 3~7 Days | 1,000.00 | ||
K6X1008C1F-BF55 |
|
SAMSUNG | SOP32 | 3~7 Days | 18,000.00 | ||
K6X1008C1F-BF70 |
|
SAMSUNG | SOP32 | 3~7 Days | 18,000.00 | ||
K6X1008C1F-GB55 |
|
SAMSUNG | SOP32 | 3~7 Days | 10,233.00 | ||
K6X1008C1F-GB70 |
|
SAMSUNG | SOP | 3~7 Days | 18,000.00 | ||
K6X1008C1F-GF55 |
|
SAMSUNG | SOP32 | 3~7 Days | 18,000.00 | ||
K6X1008C1F-GF70 |
|
SAMSUNG | SOP32 | 3~7 Days | 18,000.00 | ||
K6X1008C1F-GL55 |
|
SAMSUNG | SOP32 | 3~7 Days | 18,000.00 | ||
K6X1008C1F-GL70 |
|
SAMSUNG | SOP32 | 3~7 Days | 18,000.00 | ||
K6X1008C1F-DG70 |
|
SAMSUNG | 3~7 Days | 3,035.00 | |||
K6X1008C1F-VF55 |
|
SAMSUNG | SOP32 | 3~7 Days | 4,850.00 | ||
K6X1008C1F-VF70 |
|
SAMSUNG | SOP | 3~7 Days | 5,198.00 | ||
K6X1008C20 |
|
SAMSUNG | SOP | 3~7 Days | 101.00 |