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CC2564BRVMT
Bluetooth® 4.0 with Enhanced Data Rate (EDR), Low Energy (LE) and ANT 76-VQFNP-MR -40 to 85
CC2564BRVMT
Bluetooth® 4.0 with Enhanced Data Rate (EDR), Low Energy (LE) and ANT 76-VQFNP-MR -40 to 85
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Manufacturer Part # : CC2564BRVMT
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Package/Case: VQFNP-76
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Brand: Texas Instruments
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Product Categories : RF Transceiver ICs
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
About Payment
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If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
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CC2564BRVMT DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
for the CC2564The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following: Serial port profile (SPP)Advanced audio distribution profile (A2DP)Audio/video remote control profile (AVRCP)Handsfree profile (HFP)Human interface device (HID)Generic attribute profile (GATT) Several Bluetooth LE profiles and servicesIn addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.
Key Features
- TI’s Single-Chip Bluetooth Solution With BluetoothBasic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support; Available in Two Variants:
- Dual-Mode Bluetooth CC2564 Controller
- Bluetooth CC2560 Controller
- CC2564 Bluetooth 4.1 Controller Subsystem Qualified (QDID 58852); Compliant up to the HCI Layer
- Highly Optimized for Low-Cost Designs:
- Single-Ended 50-Ω RF Interface
- Package Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm x 8-mm mrQFN
- BR/EDR Features Include:
- Up to 7 Active Devices
- Scatternet: Up to 3 Piconets Simultaneously, 1 as Master and 2 as Slaves
- Up to 2 SCO Links on the Same Piconet
- Support for All Voice Air-Coding – Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
- CC2560B/CC2564B Devices Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
- Support of Multiple Bluetooth Profiles With Enhanced QoS
- LE Features Include:
- Support of Up to 10 (CC2564B) Connections
- Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
- Independent Buffering for LE Allows Large Numbers of Multiple Connections Without Affecting BR/EDR Performance.
- Built-In Coexistence and Prioritization Handling for BR/EDR and LE
- Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
- Class 1 TX Power Up to +10 dBm
- –95 dbm Typical RX Sensitivity
- Internal Temperature Detection andCompensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
- Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
- Provides Longer Range, Including 2x Range Over Other LE-Only Solutions
- Advanced Power Management for Extended Battery Life and Ease of Design
- On-Chip Power Management, Including Direct Connection to Battery
- Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
- Shutdown and Sleep Modes to Minimize Power Consumption
- Physical Interfaces:
- UART Interface With Support for Maximum Bluetooth Data Rates
- UART Transport Layer (H4) With Maximum Rate of 4 Mbps
- Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps (CC2560B and CC2564B Only)
- Fully Programmable Digital PCM-I2S Codec Interface
- UART Interface With Support for Maximum Bluetooth Data Rates
- Flexibility for Easy Stack Integration and Validation Into Various Microcontrollers, Such as MSP430™ and ARM® Cortex®-M3 and Cortex®-M4 MCUs
- CC256x Bluetooth Hardware Evaluation Tool: PC- Based Application to Evaluate RF Performance of the Device and Configure Service Pack
- Device Pin-to-Pin Compatible With Previous Devices or Modules
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
| Pbfree Code | Yes | Rohs Code | Yes |
| Part Life Cycle Code | Active | Reach Compliance Code | compliant |
| ECCN Code | 5A992.C | HTS Code | 8542.31.00.01 |
| JESD-30 Code | R-PQCC-N76 | JESD-609 Code | e3 |
| Length | 8 mm | Moisture Sensitivity Level | 3 |
| Number of Functions | 1 | Number of Terminals | 76 |
| Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
| Package Body Material | PLASTIC/EPOXY | Package Code | HVQCCN |
| Package Shape | RECTANGULAR | Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 | Seated Height-Max | 0.9 mm |
| Supply Voltage-Nom | 3.6 V | Surface Mount | YES |
| Telecom IC Type | TELECOM CIRCUIT | Temperature Grade | INDUSTRIAL |
| Terminal Finish | MATTE TIN | Terminal Form | NO LEAD |
| Terminal Pitch | 0.6 mm | Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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