TWS headset on Qualcomm S7 Pro Gen 1 platform

In the Bluetooth audio product market, Qualcomm platforms are the high-end first choice in this field. As an indicator leading the market development trend, it has recently launched the first new generation flagship platform Qualcomm S7 that combines high performance, low-power computing, terminal-side AI and advanced connectivity. Pro Gen1. Opens a new era of audio innovation and creates a breakthrough user experience. Setting a new benchmark for high-performance audio with ultra-low power consumption.

The first-generation Qualcomm S7 and S7 Pro platforms leverage unparalleled levels of on-device AI to create advanced, personalized and responsive audio experiences.

The computing performance of the new platform is 6 times that of the previous generation platform, and the AI ​​performance is nearly 100 times that of the previous generation platform. It also brings a new level of super flagship performance with low power consumption.

Qualcomm S7 Pro is the first audio platform to support Qualcomm's Extended Personal Area Network (XPAN) technology and ultra-low-power Wi-Fi connection, which can extend audio transmission distance in homes, buildings or campuses, and support lossless music quality up to 192kHz.

Quanding Group has also launched the TWS headset solution based on the Qualcomm S7 Pro Gen 1 platform as quickly as possible for customers to choose and apply.

The S7 Pro platform is composed of two ICs, QCC7226 and QCP7321. QCC7226 serves as the master to run user applications, Bluetooth protocols, DSP audio data processing, and AI algorithm platforms. QCP7321 serves as a co-processor to provide WIFI transmission and send and receive master controls through the SPI interface. data.

►Scenario application diagram

►Product entity diagram

►Display board photo

►Solution block diagram

►Core technical advantages
1. Fourth generation ANC noise reduction
2. Sensorless switching of Bluetooth WI-FI links, XPAN supports whole-house coverage
3. Hi-res audio, support lossless audio96k
4. AI algorithm enhancements
5. Ultra-low power consumption design

►Project specifications
1. Multi-core collaboration, doubled processing
2. Application Arm Cortex-M55 1X300MHz supports FPU operation
3. Sensor Arm Cortex-M4F 1X200MHz supports FPU
4. AI: Qualcomm eNPU 64 GOPS DSP: 2x 500 MHz + 1x 250 MHz
5.Wi-Fi Spec
6. 1 x 1 dual band 2.4/5 GHz supporting 802.11a/b/g/n standards
7. Up to 28.9 Mbps 11n MCS3 HT20 data rate
8. Supports IPv4/IPv6, TCP, UDP, and TLS
9. Internal 128Mb FLASH
10. Supports Bluetooth coexistence
11. Supports USB high speed (480 Mbps) device
12. The software provides a variety of combination configurations to flexibly build various forms of Bluetooth audio products.