XCKU5P-2FFVB676E

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XCKU5P-2FFVB676E Field Programmable Gate Array

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XCKU5P-2FFVB676E DataSheet

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XCKU5P-2FFVB676E Description

The XCKU5P-2FFVB676E is a high-performance, low-power FPGA from Xilinx, designed for a wide range of applications including telecommunications, networking, and industrial automation. This device features advanced security capabilities, robust data transfer rates, and a compact package size, making it an ideal choice for demanding systems.

Pin Details

The XCKU5P-2FFVB676E is a 2,100-pin Flip Chip Ball Grid Array (FCBGA) with a total of 2.1 million logic elements and a maximum operating frequency of 0.825V to 0.876V. It includes pins for receiving, driving, and enabling signals, along with power supply and ground connections.

Pin configuration

  • Pin 1 (RO): Receiver Output
  • Pin 2 (RE): Receiver Output Enable
  • Pin 3 (DE): Driver Output Enable
  • Pin 4 (DI): Driver Input
  • Pin 5 (GND): Ground
  • Pin 6 (A): Non-inverting Receiver Input/Driver Output
  • Pin 7 (B): Inverting Receiver Input/Driver Output
  • Pin 8 (VCC): Power Supply
  • Pin 2,100: Ground

Features

The XCKU5P-2FFVB676E features advanced security capabilities, including secure boot and encryption. It also has robust data transfer rates of up to 12 Gbps and a compact package size that makes it ideal for demanding systems.

Applications

This device is suitable for a wide range of applications including telecommunications, networking, industrial automation, and more.

Where to Use:

  • Telecommunications networks
  • Networking equipment
  • Industrial automation systems
  • Battery-powered devices
  • EMI-sensitive applications

Manufacturer

The XCKU5P-2FFVB676E is manufactured by Xilinx, a global leader in the development of programmable logic solutions.

Packages

The XCKU5P-2FFVB676E comes in a 2,100-pin Flip Chip Ball Grid Array (FCBGA) package.

Equivalent Parts of XCKU5P-2FFVB676E

  • Xilinx XC7VX690T: A comparable FPGA from Xilinx with similar features and performance.
  • Intel Cyclone V SoC: An alternative FPGA from Intel that offers equivalent functionality.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Series Kintex® UltraScale+™ Package Tray
Product Status Active Programmable Not Verified
Number of LABs/CLBs 27120 Number of Logic Elements/Cells 474600
Total RAM Bits 41984000 Number of I/O 280
Voltage - Supply 0.825V ~ 0.876V Mounting Type Surface Mount
Operating Temperature ! 0°C ~ 100°C (TJ) Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27) Base Product Number XCKU5

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