XCKU5P-2FFVB676E
XCKU5P-2FFVB676E Field Programmable Gate ArrayXCKU5P-2FFVB676E
XCKU5P-2FFVB676E Field Programmable Gate Array
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Manufacturer Part # : XCKU5P-2FFVB676E
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Package/Case: 676-BBGA,FCBGA
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Part Status : ACTIVE
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Brand: AMD
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Product Categories : FPGAs (Field Programmable Gate Array)
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Series : XCKU5
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Quality Assurance
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Service & Packaging
Service & Packaging
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XCKU5P-2FFVB676E DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Interested Parts
XCKU5P-2FFVB676E Description
The XCKU5P-2FFVB676E is a high-performance, low-power FPGA from Xilinx, designed for a wide range of applications including telecommunications, networking, and industrial automation. This device features advanced security capabilities, robust data transfer rates, and a compact package size, making it an ideal choice for demanding systems.
Pin Details
The XCKU5P-2FFVB676E is a 2,100-pin Flip Chip Ball Grid Array (FCBGA) with a total of 2.1 million logic elements and a maximum operating frequency of 0.825V to 0.876V. It includes pins for receiving, driving, and enabling signals, along with power supply and ground connections.
Pin configuration
- Pin 1 (RO): Receiver Output
- Pin 2 (RE): Receiver Output Enable
- Pin 3 (DE): Driver Output Enable
- Pin 4 (DI): Driver Input
- Pin 5 (GND): Ground
- Pin 6 (A): Non-inverting Receiver Input/Driver Output
- Pin 7 (B): Inverting Receiver Input/Driver Output
- Pin 8 (VCC): Power Supply
- Pin 2,100: Ground
Features
The XCKU5P-2FFVB676E features advanced security capabilities, including secure boot and encryption. It also has robust data transfer rates of up to 12 Gbps and a compact package size that makes it ideal for demanding systems.
Applications
This device is suitable for a wide range of applications including telecommunications, networking, industrial automation, and more.
Where to Use:
- Telecommunications networks
- Networking equipment
- Industrial automation systems
- Battery-powered devices
- EMI-sensitive applications
Manufacturer
The XCKU5P-2FFVB676E is manufactured by Xilinx, a global leader in the development of programmable logic solutions.
Packages
The XCKU5P-2FFVB676E comes in a 2,100-pin Flip Chip Ball Grid Array (FCBGA) package.
Equivalent Parts of XCKU5P-2FFVB676E
- Xilinx XC7VX690T: A comparable FPGA from Xilinx with similar features and performance.
- Intel Cyclone V SoC: An alternative FPGA from Intel that offers equivalent functionality.
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Series | Kintex® UltraScale+™ | Package | Tray |
Product Status | Active | Programmable | Not Verified |
Number of LABs/CLBs | 27120 | Number of Logic Elements/Cells | 474600 |
Total RAM Bits | 41984000 | Number of I/O | 280 |
Voltage - Supply | 0.825V ~ 0.876V | Mounting Type | Surface Mount |
Operating Temperature ! | 0°C ~ 100°C (TJ) | Package / Case | 676-BBGA, FCBGA |
Supplier Device Package | 676-FCBGA (27x27) | Base Product Number | XCKU5 |
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Price details
Prices listed do not include VAT.
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