XC6SLX75T-3FGG676I

Effective Inventory5,395

FPGA, 5831 CLBs, 862MHz

  • Manufacturer Part # : XC6SLX75T-3FGG676I

  • Package/Case: FBGA-676

  • Part Status : Active

  • Brand: AMD

  • Product Categories : FPGAs (Field Programmable Gate Array)

  • Series : XC6SLX75

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Service & Packaging

About After Sales Service

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XC6SLX75T-3FGG676I DataSheet

Pricing (USD)

Quantity Unit Price Ext. Price
1 $282.446 $282.45
200 $109.303 $21,860.60
500 $105.462 $52,731.00
1000 $103.563 $103,563.00

These prices are subject to market fluctuations, and a quote submission is required to obtain the latest prices.

Interested Parts

Rapid Quote

Please submit RFQ for XC6SLX75T-3FGG676I or email to us: Email: [email protected], we will contact you in 12 hours.

XC6SLX75T-3FGG676I Details

The XC6SLX75T-3FGG676I is a powerful and flexible FPGA (Field Programmable Gate Array) from Xilinx, designed to meet the demands of various high-performance applications. With a capacity of 75,000 logic cells, this device is suitable for complex logic designs, high-speed signal processing, and data acquisition systems. It operates at low power levels, making it an ideal choice for portable and battery-operated devices.

Pinout

  • 1 (GND): Ground
  • 2 (VCCINT): Core Voltage Supply
  • 3 (VCCO): Output Voltage Supply
  • 4 (IO): Input/Output Pins
  • 5 (CONFIG): Configuration Pins
  • 6 (CLK): Clock Input
  • 7 (DONE): Configuration Done Signal
  • 8 (JTAG): JTAG Pins for Programming

(Tip: For detailed pinout information, please refer to the corresponding datasheet.)

Key Features

  • High Logic Capacity: Provides 75,000 logic cells for complex designs.
  • Low Power Consumption: Optimized for low power operation, enhancing battery life in portable applications.
  • Multiple I/O Standards: Supports various I/O standards for compatibility with different systems.
  • Embedded Memory: Features embedded block RAM for data storage and processing.
  • Flexible Configuration: Configurable through multiple methods including JTAG and SPI.

Application

  • Embedded Systems: Ideal for use in embedded control applications and systems.
  • Signal Processing: Suitable for high-speed digital signal processing tasks.
  • Data Acquisition: Used in data acquisition systems for capturing and processing signals.

Where to Use

The XC6SLX75T-3FGG676I is suitable for applications that require high-performance logic and signal processing capabilities. It is commonly used in telecommunications, automotive, industrial automation, and consumer electronics.

How to Use

To use the XC6SLX75T-3FGG676I, connect the power supply to the VCCINT and VCCO pins, and ground to GND. Configure the device using the appropriate programming method (JTAG/SPI). Connect the input/output pins (IO) to the respective signals in your circuit. For detailed usage instructions, refer to the datasheet.

Application Circuit

The application circuit diagram for the XC6SLX75T-3FGG676I illustrates how to integrate the FPGA into your electronic system. It provides connections for power supply, ground, and I/O, ensuring that the FPGA functions correctly within your design.

(Tip: For detailed circuit diagram connections and usage guide, refer to the datasheet.)

Equivalents

  • XC6SLX50T: A similar FPGA from Xilinx with a slightly lower logic capacity.
  • Lattice ECP3-75: An alternative FPGA that offers comparable performance and capabilities.

Complementary

The XC6SLX75T-3FGG676I can be complemented by the XC6SLX100T, which provides a higher logic capacity and additional features for more demanding applications.

When selecting complementary FPGAs, ensure that their specifications align with your project's requirements for maximum compatibility and performance.

Frequently Asked Questions

Q: What is the logic capacity of the XC6SLX75T-3FGG676I?

A: The XC6SLX75T-3FGG676I has a logic capacity of 75,000 logic cells. For further details, refer to the datasheet.

Q: Can the XC6SLX75T-3FGG676I be used in battery-powered applications?

A: Yes, it is designed for low power consumption, making it suitable for battery-operated devices.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Product Category ! FPGA - Field Programmable Gate Array RoHS Details
Series XC6SLX75T Number of Logic Elements 74637 LE
Adaptive Logic Modules - ALMs 11662 ALM Embedded Memory 3.02 Mbit
Number of I/Os 348 I/O Supply Voltage - Min 1.14 V
Supply Voltage - Max 1.26 V Minimum Operating Temperature - 40 C
Maximum Operating Temperature ! + 100 C Data Rate ! 3.2 Gb/s
Number of Transceivers 8 Transceiver Mounting Style SMD/SMT
Package / Case FBGA-676 Brand AMD / Xilinx
Distributed RAM 692 kbit Embedded Block RAM - EBR 3096 kbit
Maximum Operating Frequency 1.08 GHz Moisture Sensitive Yes
Number of Logic Array Blocks - LABs 5831 LAB Operating Supply Voltage ! 1.2 V
Product Type ! FPGA - Field Programmable Gate Array Factory Pack Quantity 1
Subcategory Programmable Logic ICs Tradename Spartan
Unit Weight 0.812183 oz

FAQs

What is XC6SLX75T-3FGG676I?

The XC6SLX75T-3FGG676I is a field-programmable gate array (FPGA) manufactured by Xilinx. It belongs to the Spartan-6 family of FPGAs and is designed for applications requiring high-performance processing, such as industrial control, automotive systems, and telecommunications.

How Does XC6SLX75T-3FGG676I Work?

The XC6SLX75T-3FGG676I works by utilizing configurable logic blocks to implement custom digital circuits. It can be programmed and reconfigured to perform specific tasks, offering flexibility in design and functionality. The FPGA supports features like embedded memory blocks, digital signal processing (DSP) slices, and various I/O options for versatile applications.

How Many Pins does XC6SLX75T-3FGG676I have and What are the Functions of the Pinout Configuration?

The XC6SLX75T-3FGG676I is housed in a 676-ball Fine Grain Ball Grid Array (FGGBA) package. The pinout configuration includes:

  • VCCINT, VCCAUX: Internal core and auxiliary voltage supply pins, respectively.
  • GND: Ground pins for power return.
  • IO pins: Input/output pins for interfacing with external components.
  • Configuration pins: Pins for configuration memory access and programming.
  • Programmable logic pins: Pins for implementing custom logic functions.
  • Special function pins: Pins for specific functions like clock inputs, reset signals, and configuration mode selection.

What are the Pros and Cons of XC6SLX75T-3FGG676I?

Pros:

  • High Performance: Offers high-speed processing capabilities for demanding applications.
  • Flexibility: Can be reconfigured to adapt to different design requirements.
  • Embedded Resources: Includes embedded memory blocks and DSP slices for added functionality.
  • Scalability: Supports scalability in design by allowing for different logic block configurations.
  • Reliability: Provides reliable operation in industrial and automotive environments.

Cons:

  • Complexity: Requires expertise in FPGA programming and design for optimal utilization.
  • Power Consumption: May consume higher power compared to simpler devices, requiring careful power management.
  • Cost: FPGAs like the XC6SLX75T-3FGG676I may have a higher initial cost compared to fixed-function devices.

Are There Any Equivalents/Alternatives to XC6SLX75T-3FGG676I for Recommendation?

  • An alternative to the XC6SLX75T-3FGG676I is the EP4CE75F23I7N from Intel (formerly Altera).
  • Equivalents to the XC6SLX75T-3FGG676I include the LFE3-75EA-7FN676C from Lattice Semiconductor and the MAX 10M08SAE7C8G from Intel.

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