TLV2371IDBV

Effective Inventory6,203

With a maximum offset of 6000uV and a bandwidth of 3MHz

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TLV2371IDBV DataSheet

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TLV2371IDBV Description

The TLV2371IDBV is a high-performance operational amplifier from Texas Instruments, designed for low-noise and low-power applications. This device features rail-to-rail output, unity-gain stability, and thermal shutdown protection, making it ideal for a variety of analog circuit designs.

Features

  • Rail-to-Rail Output: Delivers excellent low-power and low-noise performance with output levels that reach rail voltage
  • Unity-Gain Stability: Ensures stable operation at high frequencies and unity-gain bandwidth
  • Thermal Shutdown Protection: Automatically turns off the amplifier when the die temperature exceeds the maximum operating junction temperature
  • Low Noise: Minimizes noise and distortion in analog circuit designs
  • Low Power Consumption: Consumes low power, making it suitable for battery-powered devices or energy-saving applications

Applications

The TLV2371IDBV is commonly used in a variety of analog and mixed-signal applications where high performance, low noise, and low power are required, including amplifiers, filters, amplifiers, and data converters.

Where to Use:

  • Aerospace and defense systems
  • Medical devices and equipment
  • Automotive systems and devices
  • wireless communication systems
  • Industrial control and monitoring systems

Manufacturer

The TLV2371IDBV is manufactured by Texas Instruments (TI), a global leader in semiconductor technology. It falls under the category of operational amplifiers, which are designed to facilitate high-performance analog circuit design.

This product was developed to meet the growing demand for low-noise and low-power operational amplifiers that can operate reliably across a wide temperature range and deliver excellent performance in various applications.

Packages

The TLV2371IDBV comes in an 8-pin SOIC-8 package. This package is designed for surface-mount technology, offering a compact and efficient solution for integrating the operational amplifier into electronic circuits.

Equivalent Parts of TLV2371IDBV

  • LMP7721: A comparable low-power operational amplifier from Texas Instruments with similar features and performance.
  • OPA333: An alternative low-noise operational amplifier from TI that offers equivalent functionality.

FAQ

Q: What is the operating temperature range of the TLV2371IDBV?
A: It operates within a wide temperature range of -40°C to +125°C, allowing it to function reliably in various environmental conditions.

Q: Does the TLV2371IDBV have thermal shutdown protection?
A: Yes, it features automatic thermal shutdown protection to prevent damage from excessive die temperatures.

Q: Can the TLV2371IDBV be used in aerospace and defense applications?
A: Yes, its high-performance and low-noise characteristics make it suitable for use in critical systems where reliability and performance are essential.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Part Life Cycle Code Obsolete Part Package Code SOT-23
Pin Count ! 5 ECCN Code EAR99
HTS Code ! 8542.33.00.01 Amplifier Type OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK Average Bias Current-Max (IIB) 0.00006 µA
Bias Current-Max (IIB) @25C 0.00006 µA Common-mode Reject Ratio-Min 55 dB
Common-mode Reject Ratio-Nom 72 dB Frequency Compensation ! YES
Input Offset Current-Max (IIO) 0.00006 µA Input Offset Voltage-Max 4500 µV
JESD-30 Code R-PDSO-G5 JESD-609 Code e4
Length 2.9 mm Low-Bias YES
Low-Offset NO Micropower ! NO
Number of Functions 1 Number of Terminals 5
Operating Temperature-Max 125 °C Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY Package Code LSSOP
Package Equivalence Code TSOP5/6,.11,37 Package Shape RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH Power NO
Programmable Power ! NO Qualification Status ! Not Qualified
Seated Height-Max 1.45 mm Slew Rate-Min 1 V/us
Slew Rate-Nom 2.4 V/us Supply Current-Max 0.66 mA
Supply Voltage Limit-Max 16.5 V Supply Voltage-Nom (Vsup) 5 V
Surface Mount ! YES Technology CMOS
Temperature Grade ! AUTOMOTIVE Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form ! GULL WING Terminal Pitch ! 0.95 mm
Terminal Position DUAL Unity Gain BW-Nom 3000
Wideband YES Width 1.6 mm

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification TLV2371IDBV PDF Download

FAQs

What is TLV2371IDBV?

The TLV2371IDBV is a low-power, precision CMOS operational amplifier designed by Texas Instruments. It is ideal for applications requiring low voltage operation, low offset voltage, and high open-loop gain, such as sensor interfaces, portable devices, and battery-powered systems.

How Does TLV2371IDBV Work?

The TLV2371IDBV operates as a precision operational amplifier with low offset voltage and high open-loop gain. It amplifies input signals with high accuracy and stability, making it suitable for precision measurement and signal conditioning applications. The amplifier features rail-to-rail input and output, ensuring maximum signal swing even at low supply voltages.

How Many Pins does TLV2371IDBV have and What are the Functions of the Pinout Configuration?

The TLV2371IDBV is housed in an 8-lead SOIC (Small Outline Integrated Circuit) package. The pinout configuration includes:

  • V+: Positive power supply pin.
  • V-: Negative power supply pin.
  • IN+: Non-inverting input pin.
  • IN-: Inverting input pin.
  • OUT: Output pin.

What are the Pros and Cons of TLV2371IDBV?

Pros:

  • Low Power Consumption: Operates with very low power, making it ideal for battery-operated devices.
  • Precision: Provides low offset voltage and low drift, ensuring accurate signal amplification.
  • Rail-to-Rail Input and Output: Maximizes signal swing, enhancing dynamic range.
  • High Open-Loop Gain: Suitable for applications requiring high gain and precision amplification.

Cons:

  • Limited Bandwidth: May not be suitable for high-frequency applications.
  • External Components: May require additional external components for optimal performance in certain applications.
  • Package Handling: The 8-lead SOIC package may be challenging to handle without appropriate equipment.

Are There Any Equivalents/Alternatives to TLV2371IDBV for Recommendation?

  • The equivalent part to the TLV2371IDBV is the MCP602 from Microchip Technology.
  • Alternatives to the TLV2371IDBV include the LMC6482 from Texas Instruments and the TS912 from STMicroelectronics.

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