THGBMJG8C4LBAU8

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ROHS eMMC THGBMJG8C4LBAU8 FBGA-153

Quality Assurance

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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Cut Tape

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Tube or Tray

Tube or Tray

THGBMJG8C4LBAU8 DataSheet

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Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

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Rapid Quote

Please submit RFQ for THGBMJG8C4LBAU8 or email to us: Email: [email protected], we will contact you in 12 hours.

THGBMJG8C4LBAU8 Details

The THGBMJG8C4LBAU8 is a NAND flash memory chip developed by KIOXIA, designed for reliable data storage and retrieval in various applications. This device features 64GB of storage capacity, LPDDR4X memory interface, and advanced security features, making it suitable for high-reliability systems.

Key Features

  • 64GB Storage Capacity: Provides ample storage space for large amounts of data.
  • LPDDR4X Memory Interface: Offers high-speed data transfer and efficient memory access.
  • NAND Flash Technology: Enables reliable and durable data storage with low power consumption.
  • Four-Plane Design: Enhances read and write performance, making it suitable for demanding applications.
  • Fast Read/Write Speeds: Supports high-speed data transfer and retrieval.
  • Low Power Consumption: Designed to minimize power consumption and reduce heat generation.
  • Built-in ECC Support: Provides error correction and detection for reliable data storage and retrieval.
  • Small Form Factor: Compact design makes it suitable for space-constrained systems.
  • High Reliability: Designed to operate reliably in demanding environments with high temperatures, vibrations, and shock.

Applications

The THGBMJG8C4LBAU8 is suitable for various applications that require reliable data storage and retrieval, including:

  • Data Centers and Cloud Storage
  • Embedded Systems and IoT Devices
  • Automotive and Industrial Control Systems
  • Artificial Intelligence and Machine Learning Applications

Where to Use

The THGBMJG8C4LBAU8 is designed for use in a variety of environments, including:

  • Temperature ranges from -40°C to 85°C
  • Vibration and shock resistance
  • High-reliability systems requiring low power consumption

How to Use

To use the THGBMJG8C4LBAU8, follow these steps:

  1. Integrate the chip into your system or connect it to a controller.
  2. Configure the chip's settings and parameters according to your application requirements.
  3. Write data to the chip using the LPDDR4X memory interface.
  4. Read data from the chip using the LPDDR4X memory interface.

(Tip: For detailed information on how to integrate and use the THGBMJG8C4LBAU8, please refer to the corresponding datasheet.)

Application Circuit

The application circuit diagram for the THGBMJG8C4LBAU8 illustrates how to integrate the chip into a system or connect it to a controller. It includes connections for power supply, ground, and data transfer lines, ensuring proper operation and reliable data storage.

(Tip: For detailed circuit diagram connections and usage guide, refer to the datasheet.)

Equivalents

  • Other NAND Flash Memory Chips: Alternative chips from various manufacturers offering similar features and performance.

Complementary

The THGBMJG8C4LBAU8 can be complemented by other components that enhance its functionality, such as:

  • Controllers and Interface Chips: Enable data transfer and management between the THGBMJG8C4LBAU8 and other system components.
  • Power Management ICs: Regulate power supply to the chip and minimize power consumption.
THGBMJG8C4LBAU8

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Product Category ! eMMC Shipping Restrictions This product may require additional documentation to export from the United States.
RoHS Details Series THGBM
Package / Case FBGA-153 Memory Size ! 32 GB
Sequential Read 400 MB/s Interface Type eMMC 5.1
Supply Voltage - Min 2.7 V Supply Voltage - Max 3.6 V
Minimum Operating Temperature - 40 C Maximum Operating Temperature ! + 105 C
Brand Kioxia America Dimensions 11.5 mm x13 mm x 1.2 mm
Moisture Sensitive Yes Mounting Style SMD/SMT
Product eMMC Flash Drives Product Type ! eMMC
Factory Pack Quantity 152 Subcategory Memory & Data Storage
Unit Weight 0.142391 oz

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification THGBMJG8C4LBAU8 PDF Download

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