TC58DVM82A1FT00
IC 32M X 8 EEPROM 3V, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48, Programmable ROMTC58DVM82A1FT00
IC 32M X 8 EEPROM 3V, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48, Programmable ROM
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We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
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TC58DVM82A1FT00 DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Interested Parts
TC58DVM82A1FT00 Description
The TC58DVM82A1FT00 is a NAND flash memory chip manufactured by Toshiba, designed for use in various electronic devices that require high-density data storage and reliable performance.
Pin Details
The TC58DVM82A1FT00 is a 32M x 8 EEPROM with a capacity of 256 megabits (32 megabytes), operating at 3.0 volts, using a Toggle DDR interface, and designed for use in various electronic devices like smartphones, tablets, and solid-state drives (SSDs).
Features
- High-density data storage: Offers a capacity of 256 megabits (32 megabytes) for storing large amounts of data.
- Reliable performance: Designed to provide fast and reliable data transfer rates, making it suitable for use in various electronic devices.
- Low power consumption: Optimized for low power usage, ideal for battery-powered devices or applications where power efficiency is crucial.
- Wide operating temperature range: Operates efficiently between -40°C and +125°C, allowing it to function reliably in various environmental conditions.
Applications
The TC58DVM82A1FT00 is commonly used in applications requiring high-density data storage, such as smartphones, tablets, solid-state drives (SSDs), digital cameras, and other consumer electronics devices.
Where to Use:
- Smartphones
- Tablets
- Solid-state drives (SSDs)
- Digital cameras
- Other consumer electronics devices
Manufacturer
The TC58DVM82A1FT00 is manufactured by Toshiba, a global leader in semiconductor technology.
Packages
The TC58DVM82A1FT00 comes in a BGA (Ball Grid Array) package, designed for surface-mount technology and offering a compact and efficient solution for integrating the chip into electronic circuits.
Equivalent Parts of TC58DVM82A1FT00
- Toshiba's TC58DVM81A1FT00: A comparable NAND flash memory chip with similar features and performance.
- Samsung's K9F2G08U0M: An alternative NAND flash memory chip that offers equivalent functionality.
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Rohs Code | No | Part Life Cycle Code | Obsolete |
Part Package Code | TSOP1 | Pin Count ! | 48 |
JESD-30 Code | R-PDSO-G48 | JESD-609 Code | e0 |
Length | 18.4 mm | Memory Density | 268435456 bit |
Memory IC Type | EEPROM | Memory Width | 8 |
Number of Functions | 1 | Number of Terminals | 48 |
Number of Words | 33554432 words | Number of Words Code | 32000000 |
Operating Mode ! | ASYNCHRONOUS | Operating Temperature-Max | 70 °C |
Organization | 32MX8 | Package Body Material | PLASTIC/EPOXY |
Package Code | TSOP1 | Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE, THIN PROFILE | Parallel/Serial | SERIAL |
Peak Reflow Temperature (Cel) | 240 | Programming Voltage ! | 3 V |
Qualification Status ! | Not Qualified | Seated Height-Max | 1.2 mm |
Supply Voltage-Max (Vsup) | 3.6 V | Supply Voltage-Min (Vsup) | 2.7 V |
Supply Voltage-Nom (Vsup) | 3.3 V | Surface Mount ! | YES |
Technology | CMOS | Temperature Grade ! | COMMERCIAL |
Terminal Finish | TIN LEAD | Terminal Form ! | GULL WING |
Terminal Pitch ! | 0.5 mm | Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | Width | 12 mm |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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Price details
Prices listed do not include VAT.
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