QSC6010
Telecom IC,QSC6010
Telecom IC,
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Manufacturer Part # : QSC6010
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Package/Case: BGA
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Brand: Qualcomm Technologies
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Product Categories : Telecom
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.






Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.








About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

WireTransfer

Paypal

CreditCard

WesternUnion

MoneyGram
Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

Example

Tape and Reel

Cut Tape

Tube or Tray
QSC6010 DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Interested Parts
QSC6010 Description
The QSC6010 chip is a highly integrated solution featuring a baseband processor, power management, digital radio processor, and audio features, designed for use in advanced audio distribution applications.
Pin Details
The QSC6010 is a system-on-chip (SoC) with 64-bit ARM-based CPU, dual-core 1.6 GHz cores, supports DDR4 memory, integrated hardware acceleration engines for packet processing, power-efficient design for reduced energy consumption, advanced security features for data protection, and scalable architecture for flexible deployment options.
Features
- High-performance CPU: Dual-core 1.6 GHz cores with 64-bit ARM-based architecture
- Memory Support: Supports DDR4 memory for efficient data processing
- Packet Processing: Integrated hardware acceleration engines for fast packet processing
- Power Efficiency: Power-efficient design for reduced energy consumption
- Data Security: Advanced security features for data protection
- Scalability: Scalable architecture for flexible deployment options
Applications
The QSC6010 is particularly well-suited for products that require high-quality audio processing, network connectivity, and advanced control capabilities in a compact form factor.
Where to Use:
- Advanced audio distribution systems
- Professional audio equipment
- Industrial automation systems
- Broadcasting and streaming applications
Manufacturer
The QSC6010 is manufactured by Qualcomm, a global leader in semiconductor technology.
Packages
The QSC6010 comes in an BGA (Ball Grid Array) package, making it suitable for compact circuit designs and high-density packaging.
Equivalent Parts of QSC6010
- TI OMAP: A comparable system-on-chip (SoC) from Texas Instruments with similar features and performance.
- Intel Atom: An alternative processor solution from Intel that offers equivalent functionality.
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Part Life Cycle Code | Obsolete |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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Price details
Prices listed do not include VAT.
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