MT62F1G32D2DS-023 IT:C

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Reliable and Secure DRAM Memory Solution for Industrial Automation, 32 Gbit

  • Manufacturer Part # : MT62F1G32D2DS-023 IT:C

  • Package/Case: TFBGA-315-315

  • Brand: Micron

  • Product Categories : Memory

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Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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MT62F1G32D2DS-023 IT:C DataSheet

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Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Interested Parts

Rapid Quote

Please submit RFQ for MT62F1G32D2DS-023 IT:C or email to us: Email: [email protected], we will contact you in 12 hours.

MT62F1G32D2DS-023 IT:C Description

The MT62F1G32D2DS-023 IT:C is a high-performance DRAM chip from Micron, designed for mobile LPDDR5 SDRAM applications. This device features 32 Gbit of memory and an impressive 1Gx32 configuration, making it suitable for demanding mobile devices that require fast data transfer.

Features

  • Fast Data Transfer: supports high-speed data transfer for demanding mobile applications
  • High-Density Configuration: features 32 Gbit of memory and a 1Gx32 configuration for maximum performance
  • Reliable Operation: engineered for reliable operation in harsh environments

Applications

This DRAM chip is designed specifically for mobile LPDDR5 SDRAM applications, making it an essential component in cutting-edge smartphones and tablets.

Where to Use:

  • Mobile devices (smartphones, tablets)
  • Mainstream computing systems
  • Enterprise storage solutions
  • Data centers and cloud infrastructure

Manufacturer

The MT62F1G32D2DS-023 IT:C is manufactured by Micron Technology, a leader in the development of innovative memory solutions.

Micron has developed this product to meet the growing demand for high-performance, low-power DRAM chips in mobile and mainstream computing applications.

Packages

The MT62F1G32D2DS-023 IT:C is packaged in a TFBGA-315-315 (Thin-Film-Ball Grid Array) package, designed for surface-mount technology adoption.

Equivalent Parts of MT62F1G32D2DS-023 IT:C

  • MT60R512M128F4E1T: a similar DRAM chip from Micron with similar features and performance

FAQ

Q: What is the operating temperature range of the MT62F1G32D2DS-023 IT:C?
A: It operates within a typical industrial temperature range of -40°C to +125°C, allowing it to function reliably in various environmental conditions.

Q: Is the MT62F1G32D2DS-023 IT:C designed specifically for mobile applications?
A: Yes, it is designed with features and configurations optimized for high-performance mobile devices that require fast data transfer and low power consumption.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Product Category ! DRAM RoHS Details
Mounting Style SMD/SMT Package / Case TFBGA-315-315
Brand Micron Product Type ! DRAM
Factory Pack Quantity 1050 Subcategory Memory & Data Storage

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