LCMXO1200C-3FTN256C

Name: LCMXO1200C-3FTN256C
Brand: Lattice Semiconductor
Availability: InStock
Rating: 4.5 (10 reviews)
Author: Lisleapex

Cutting-edge Field Programmable Gate Array with 1200 LUTs and 211 I/O options for flexible design configurations

4,346 Effective Inventory

LCMXO1200C-3FTN256C

Effective Inventory4,346

Cutting-edge Field Programmable Gate Array with 1200 LUTs and 211 I/O options for flexible design configurations

Manufacturer Part # : LCMXO1200C-3FTN256C
Package/Case: FTBGA-256
Brand: Lattice Semiconductor
Product Categories : FPGAs (Field Programmable Gate Array)
Series : LCMXO1200

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LCMXO1200C-3FTN256C DataSheet

Pricing (USD)

Quantity	Unit Price	Ext. Price
1	$23.074	$23.07
200	$8.929	$1,785.80
500	$8.616	$4,308.00
1000	$8.460	$8,460.00

These prices are subject to market fluctuations, and a quote submission is required to obtain the latest prices.

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LCMXO1200C-3FTN256C Details

When it comes to low-power, cost-sensitive applications, the LCMXO1200C-3FTN256C FPGA from Lattice Semiconductor is the perfect solution. With 1200 LUTs, 64 Kbit Embedded Block RAM, and 18 I/O pins, this FPGA offers the flexibility and performance required for industrial control systems, consumer electronics, automotive infotainment, and communication equipment. Its compact 256-pin TQFP package makes it suitable for space-constrained designs, while its maximum frequency of 75 MHz ensures efficient operation. Plus, with a supply voltage of 1.2V, this FPGA is designed for low power consumption, making it an excellent choice for a wide range of applications

Key Features

Non-volatile, Infinitely Reconfigurable
Instant-on – powers up in microseconds
Single chip, no external configuration memory
required
Excellent design security, no bit stream to
intercept
Reconfigure SRAM based logic in milliseconds
SRAM and non-volatile memory programmable
through JTAG port
Supports background programming of
non-volatile memory
Sleep Mode
Allows up to 100x static current reduction
TransFR™ Reconfiguration (TFR)
In-field logic update while system operates
High I/O to Logic Density
256 to 2280 LUT4s
73 to 271 I/Os with extensive package options
Density migration supported
Lead free/RoHS compliant packaging
Embedded and Distributed Memory
Up to 27.6 Kbits sysMEM™ Embedded Block
RAM
Up to 7.5 Kbits distributed RAM
Dedicated FIFO control logic
Flexible I/O Buffer
Programmable sysIO™ buffer supports wide
range of interfaces:
− LVCMOS 3.3/2.5/1.8/1.5/1.2
− LVTTL
− PCI
− LVDS, Bus-LVDS, LVPECL, RSDS
sysCLOCK™ PLLs
Up to two analog PLLs per device
Clock multiply, divide, and phase shifting
System Level Support
IEEE Standard 1149.1 Boundary Scan
Onboard oscillator
Devices operate with 3.3V, 2.5V, 1.8V or 1.2V
power supply
IEEE 1532 compliant in-system programming

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Pbfree Code	Yes	Rohs Code	Yes
Part Life Cycle Code	Active	Part Package Code	BGA
Pin Count !	256	Reach Compliance Code	compliant
ECCN Code	3A991.D	HTS Code !	8542.39.00.01
JESD-30 Code	S-PBGA-B256	JESD-609 Code	e1
Length	17 mm	Moisture Sensitivity Level	3
Number of CLBs	150	Number of Inputs	211
Number of Logic Cells !	1200	Number of Outputs	211
Number of Terminals	256	Operating Temperature-Max	85 °C
Operating Temperature-Min		Organization	150 CLBS
Package Body Material	PLASTIC/EPOXY	Package Code	LBGA
Package Equivalence Code	BGA256,16X16,40	Package Shape	SQUARE
Package Style	GRID ARRAY, LOW PROFILE	Peak Reflow Temperature (Cel)	260
Power Supplies !	1.8/3.3 V	Programmable Logic Type !	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status !	Not Qualified	Seated Height-Max	1.7 mm
Supply Voltage-Max	3.465 V	Supply Voltage-Min	1.71 V
Supply Voltage-Nom	1.8 V	Surface Mount !	YES
Temperature Grade !	OTHER	Terminal Finish	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form !	BALL	Terminal Pitch !	1 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	40
Width	17 mm

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification LCMXO1200C-3FTN256C PDF Download

FAQs

What is LCMXO1200C-3FTN256C?

The LCMXO1200C-3FTN256C is a low-cost, low-power, and high-performance FPGA (Field-Programmable Gate Array) manufactured by Lattice Semiconductor. It is designed for applications that require programmable logic and high-speed processing, such as industrial control, consumer electronics, and communications systems.

How Does LCMXO1200C-3FTN256C Work?

The LCMXO1200C-3FTN256C works by providing a reconfigurable platform for implementing digital logic functions. Users can program the FPGA to perform specific tasks and functions using a hardware description language (HDL) such as Verilog or VHDL. The device offers flexible I/O options, logic elements, and memory resources to accommodate a wide range of applications.

How Many Pins does LCMXO1200C-3FTN256C have and What are the Functions of the Pinout Configuration?

The LCMXO1200C-3FTN256C is housed in a 256-pin fine pitch Thin Quad Flat Pack (TQFP) package. The pinout configuration includes:

IOB: Input/output buffer pins for general-purpose I/O.
GB: Global buffer pins for interconnection and routing.
CONFIG: Configuration pins for device initialization and programming.
PLL: Phase-locked loop pins for clock management and frequency synthesis.
VCCINT, VCCIO: Internal and I/O power supply pins, respectively.
GND: Ground pins for internal and I/O circuitry.

What are the Pros and Cons of LCMXO1200C-3FTN256C?

Pros:

Low Cost: Provides cost-effective programmable logic for various applications.
Low Power: Offers low power consumption suitable for battery-powered or energy-efficient designs.
High Performance: Delivers high-speed processing and reconfigurable logic for versatile applications.
Flexible I/O: Accommodates a wide range of input and output options for connectivity and interfacing.
Integration: Enables multiple functions to be implemented within a single device, reducing external components.

Cons:

Complexity: Requires expertise in digital design and programming for effective utilization.
Resource Limitation: May have limited resources compared to higher-end FPGAs for complex designs.
Configuration Time: Programming and configuring the FPGA may require additional time and effort during the development phase.

Are There Any Equivalents/Alternatives to LCMXO1200C-3FTN256C for Recommendation?

The LFE3-17EA-6FTN256C from Lattice Semiconductor is a comparable FPGA with similar features and capabilities.
Alternatives to the LCMXO1200C-3FTN256C include the Spartan-6 series from Xilinx and the Cyclone series from Intel (formerly Altera).