KLM8G1GEAC-B031

Kioxia's KLM8G1GEAC-B031 is a 512Gb 3D TLC NAND flash memory chip.
7,425 Effective Inventory

KLM8G1GEAC-B031

Effective Inventory7,425

Kioxia's KLM8G1GEAC-B031 is a 512Gb 3D TLC NAND flash memory chip.

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

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KLM8G1GEAC-B031 DataSheet
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KLM8G1GEAC-B031 Description

The KLM8G1GEAC-B031 is a 512Gb 3D TLC NAND flash memory chip from Kioxia, designed for high-performance storage solutions in various applications.

Pin Details

This chip features an 8GB capacity and supports SATA interface for efficient data transfer. It utilizes 3D NAND technology to provide fast read speeds of up to 555 MB/s and write speeds of up to 158 MB/s.

Features

  • High Capacity: Offers a storage capacity of 512Gb for storing large amounts of data.
  • Fast Read/Write Speeds: Supports read speeds up to 555 MB/s and write speeds up to 158 MB/s for efficient data transfer.
  • Low Power Consumption: Optimized for low power usage, ideal for battery-powered devices or applications where power efficiency is crucial.
  • Shock and Vibration Resistant: Designed to withstand shock and vibration, making it suitable for use in various industrial and consumer applications.
  • Operating Temperature Range: Operates efficiently between 0°C to 70°C, allowing for reliable performance in a wide range of environments.

Applications

The KLM8G1GEAC-B031 is suitable for various applications that require high-performance storage solutions, including consumer electronics such as smartphones and tablets, industrial applications like robotics and IoT devices, automotive industry for infotainment systems and ADAS, medical equipment for imaging devices and diagnostic tools, and networking equipment for routers, switches, and servers.

Where to Use:

  • Consumer electronics such as smartphones and tablets
  • Industrial applications like robotics and IoT devices
  • Automotive industry for infotainment systems and ADAS
  • Medical equipment for imaging devices and diagnostic tools
  • Networking equipment for routers, switches, and servers

Manufacturer

The KLM8G1GEAC-B031 is manufactured by Kioxia, a leading global provider of flash memory solutions.

Packages

This chip comes in an 8-pin BGA (Ball Grid Array) package for efficient integration into electronic circuits.

Equivalent Parts of KLM8G1GEAC-B031

  • Kioxia KLX16G4G31A: A comparable high-capacity NAND flash memory chip from Kioxia with similar features and performance.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Manufacturer SAMSUNG Product Category ! IC Chips

FAQs

What is KLM8G1GEAC-B031?

The KLM8G1GEAC-B031 is a 8GB eMMC (embedded MultiMediaCard) memory module designed by Samsung. It is ideal for use in mobile devices, such as smartphones, tablets, and portable media players, as well as in automotive and industrial applications.

How Does KLM8G1GEAC-B031 Work?

The KLM8G1GEAC-B031 works by providing non-volatile storage for data and programs in a compact, integrated format. It utilizes an embedded controller and NAND flash memory to store and retrieve digital information, enabling the seamless operation of connected devices.

How Many Pins does KLM8G1GEAC-B031 have and What are the Functions of the Pinout Configuration?

The KLM8G1GEAC-B031 is housed in a compact BGA (Ball Grid Array) package. The pinout configuration includes:

  • Data I/O: Pins for data input and output communication with the host device.
  • Power Supply: Pins for supplying power to the module for operation.
  • Control Signals: Pins for control signals such as clock, reset, and device identification.
  • Ground Connections: Pins for grounding the module to the host device.

What are the Pros and Cons of KLM8G1GEAC-B031?

Pros:

  • High Capacity: Offers 8GB of storage space for data and programs.
  • Compact Form Factor: The BGA package provides a space-efficient and integrated storage solution.
  • Embedded Controller: Includes an embedded controller for seamless integration and operation.
  • Reliability: NAND flash memory technology provides reliable and durable storage.

Cons:

  • Integration Complexity: BGA packages may require specialized equipment and expertise for integration into host devices.
  • Endurance: As with all NAND flash memory, the endurance of the storage may be a consideration for certain applications.
  • Cost: Higher capacity eMMC modules may have a higher cost compared to lower-capacity alternatives.

Are There Any Equivalents/Alternatives to KLM8G1GEAC-B031 for Recommendation?

  • Similar eMMC modules to the KLM8G1GEAC-B031 include the THGBM3G9D8KBAIE from Toshiba and the SDINBDG4-8G from SanDisk.
  • Alternatives to the KLM8G1GEAC-B031 include MBI8GEA from Micron and EM-08GEMC from SK Hynix.

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