K9WAG08U1B-PIB0
The K9WAG08U1B-PIB0 chip is a NAND flash memory device manufactured by SamsungK9WAG08U1B-PIB0
The K9WAG08U1B-PIB0 chip is a NAND flash memory device manufactured by Samsung
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Manufacturer Part # : K9WAG08U1B-PIB0
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Package/Case: TSOP-48
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Brand: Samsung Electro-Mechanics
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Product Categories : Microcontrollers
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Service & Packaging
Service & Packaging
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K9WAG08U1B-PIB0 DataSheet

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Interested Parts
K9WAG08U1B-PIB0 Description
The K9WAG08U1B-PIB0 is a 2Gb (256MB) NAND Flash Memory from Samsung Semiconductor, designed for high-speed program operation and low power consumption. This device is ideal for industrial communication applications, featuring advanced wear-leveling algorithm and on-chip ECC engine for data reliability.
Pin Details
The K9WAG08U1B-PIB0 is a 48-pin package with the following pin configuration:
- Pin 1 (VCC): Positive Power Supply
- Pin 2 (GND): Ground
- Pin 3-47: Data I/O Pins
Features
- High-speed program operation: Supports fast programming speeds for efficient data transfer.
- Low power consumption: Optimized for low power usage, ideal for battery-powered devices.
- Advanced wear-leveling algorithm: Ensures reliable performance and extends the lifespan of the device.
- On-chip ECC engine: Provides data reliability through error correction capabilities.
Applications
The K9WAG08U1B-PIB0 is commonly used in industrial communication systems, such as smart factories, building automation, and automotive applications.
Where to Use:
- Industrial control systems
- Automotive electronics
- Building automation systems
- Battery-powered devices
Manufacturer
The K9WAG08U1B-PIB0 is manufactured by Samsung Semiconductor, a global leader in semiconductor technology.
Packages
The K9WAG08U1B-PIB0 comes in a 48-pin BGA (Ball Grid Array) package.
Equivalent Parts of K9WAG08U1B-PIB0
- K9HAG08U1A: A comparable NAND Flash Memory from Samsung Semiconductor with similar features and performance.

Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Rohs Code | Yes | Part Life Cycle Code | Obsolete |
ECCN Code | EAR99 | HTS Code ! | 8542.32.00.51 |
Access Time-Max | 25 ns | Command User Interface | YES |
Data Polling | NO | JESD-30 Code | R-PDSO-G48 |
Memory Density | 17179869184 bit | Memory IC Type | FLASH |
Memory Width | 8 | Number of Sectors/Size | 16K |
Number of Terminals | 48 | Number of Words | 2147483648 words |
Number of Words Code | 2000000000 | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | Organization | 2GX8 |
Package Body Material | PLASTIC/EPOXY | Package Code | TSSOP |
Package Equivalence Code | TSSOP48,.8,20 | Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Page Size | 2K words |
Parallel/Serial | PARALLEL | Power Supplies ! | 3/3.3 V |
Qualification Status ! | Not Qualified | Ready/Busy | YES |
Sector Size | 128K | Standby Current-Max | 0.0002 A |
Supply Current-Max | 0.035 mA | Surface Mount ! | YES |
Technology | CMOS | Temperature Grade ! | INDUSTRIAL |
Terminal Form ! | GULL WING | Terminal Pitch ! | 0.5 mm |
Terminal Position | DUAL | Toggle Bit | NO |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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