K4H561638N-LCB3
DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66K4H561638N-LCB3
DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66
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Manufacturer Part # : K4H561638N-LCB3
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Package/Case: TSOP-66
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Brand: Samsung Electro-Mechanics
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Product Categories : Controllers
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.






Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.








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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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K4H561638N-LCB3 DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
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K4H561638N-LCB3 Details
The K4H561638N-LCB3 is a DDR3 SDRAM manufactured by Samsung Semiconductor. It features a capacity of 2GB, organized in a x16 configuration. Operating at a voltage of 1.5V, it has a speed of 1333MHz and utilizes a 96-ball FBGA package.
The K4H561638N-LCB3 is commonly used in computer memory modules, laptops, desktops, and servers. It's also found in various consumer electronics like digital cameras, gaming consoles, and networking equipment. Additionally, it's utilized in automotive electronics and industrial applications requiring high-speed data storage and retrieval.
K4H561638N-LCB3 Key Features
- Capacity: 2GB
- Organized in a x16 configuration
- Operating Voltage: 1.5V
- Speed: 1333MHz
- Package Type: 96-ball FBGA
K4H561638N-LCB3 Product Usage
The K4H561638N-LCB3 is a DDR3 SDRAM IC designed for use in various applications that require high-speed data storage and retrieval. Some typical applications and circuits that use the K4H561638N-LCB3 include:
Computer and Consumer Electronics:
- Memory Modules: The K4H561638N-LCB3 is used in memory modules for laptops, desktops, and servers.
- Digital Cameras: It's found in digital cameras requiring high-speed data storage and retrieval.
- Gaming Consoles: The IC is used in gaming consoles that require fast data transfer rates.
- Networking Equipment: It's utilized in networking equipment, such as routers and switches, for high-speed data processing.
Automotive and Industrial Applications:
- Automotive Electronics: The K4H561638N-LCB3 is used in automotive electronics that require high-speed data storage and retrieval.
- Industrial Control Systems: It's utilized in industrial control systems, such as manufacturing automation and process control systems, for fast data processing.
K4H561638N-LCB3 Quality and Reliability
Samsung Semiconductor's commitment to quality ensures that the K4H561638N-LCB3 IC is reliable and performs consistently. It is designed to meet the stringent requirements of industrial and commercial applications, where consistent operation and long service life are critical.
K4H561638N-LCB3 Ordering Information
The K4H561638N-LCB3 is available in tape and reel packaging, facilitating efficient assembly for high-volume production. Its product identification, including the temperature range and package type, is clearly specified for ease of ordering.
K4H561638N-LCB3 Package and Quality
The K4H561638N-LCB3 is housed in a compact, thermally efficient 96-ball FBGA package, making it suitable for space-constrained designs without compromising on thermal management or performance. Samsung Semiconductor ensures that each unit undergoes rigorous testing to meet stringent automotive and industrial standards. This emphasis on quality guarantees that the K4H561638N-LCB3 delivers dependable, long-term performance across a wide range of operational environments.
Conclusion
The K4H561638N-LCB3 from Samsung Semiconductor is an ideal choice for engineers seeking a reliable DDR3 SDRAM IC for high-speed data storage and retrieval. With its versatile functionality, integrated protection features, and fast data transfer rates, it is well-suited for applications across computer and consumer electronics, automotive, and industrial sectors. Whether used in memory modules, digital cameras, or industrial control systems, the K4H561638N-LCB3 provides robust performance and flexibility, making it a valuable component for demanding applications.
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Pbfree Code | Yes | Rohs Code | Yes |
Part Life Cycle Code | Obsolete | Reach Compliance Code | compliant |
ECCN Code | EAR99 | HTS Code ! | 8542.32.00.24 |
Access Time-Max | 0.7 ns | Clock Frequency-Max (fCLK) | 166 MHz |
I/O Type | COMMON | Interleaved Burst Length | 2,4,8 |
JESD-30 Code | R-PDSO-G66 | JESD-609 Code | e3 |
Memory Density | 268435456 bit | Memory IC Type | DDR1 DRAM |
Memory Width | 16 | Moisture Sensitivity Level | 3 |
Number of Terminals | 66 | Number of Words | 16777216 words |
Number of Words Code | 16000000 | Operating Temperature-Max | 70 °C |
Organization | 16MX16 | Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY | Package Code | TSSOP |
Package Equivalence Code | TSSOP66,.46 | Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Peak Reflow Temperature (Cel) | 260 |
Power Supplies ! | 2.5 V | Qualification Status ! | Not Qualified |
Refresh Cycles | 8192 | Sequential Burst Length | 2,4,8 |
Standby Current-Max | 0.003 A | Supply Current-Max | 0.12 mA |
Supply Voltage-Nom (Vsup) | 2.5 V | Surface Mount ! | YES |
Technology | CMOS | Temperature Grade ! | COMMERCIAL |
Terminal Finish | MATTE TIN | Terminal Form ! | GULL WING |
Terminal Pitch ! | 0.635 mm | Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | 30 |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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