K4H511638C-UCB3

DDR DRAM, 32MX16, 0.7ns, CMOS, PDSO66,
7,398 Effective Inventory

K4H511638C-UCB3

Effective Inventory7,398

DDR DRAM, 32MX16, 0.7ns, CMOS, PDSO66,

Quality Assurance

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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WireTransfer

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CreditCard

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WesternUnion

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MoneyGram

Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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Example

Tape and Reel

Tape and Reel

Cut Tape

Cut Tape

Tube or Tray

Tube or Tray

K4H511638C-UCB3 DataSheet
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Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

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Rapid Quote

Please submit RFQ for K4H511638C-UCB3 or email to us: Email: [email protected], we will contact you in 12 hours.

K4H511638C-UCB3 Details

The K4H511638C-UCB3 is a DDR2 SDRAM chip commonly used in electronic devices for memory storage and data processing.

K4H511638C-UCB3 Key Features

  • 512M x 16bit DDR2 SDRAM
  • Operates at 1.8V and has a clock frequency of 533MHz
  • This memory module has a high-speed data transfer rate with a burst length of 4 and operates in a 66-pin FBGA package
  • Ideal for high-performance computing applications that require fast and efficient memory access

K4H511638C-UCB3 Product Usage

The K4H511638C-UCB3 is an ideal memory solution for various electronic devices, including:

Computer Systems:

  • Laptops and desktops requiring high-speed data transfer rates
  • Servers and workstations demanding fast memory access

Embedded Systems:

  • Industrial control systems, automotive electronics, and medical devices that require reliable memory storage
  • Consumer electronics such as digital cameras, printers, and gaming consoles that need high-speed data transfer rates

K4H511638C-UCB3 Circuit Diagram

A sample circuit diagram using the K4H511638C-UCB3 might involve:

  • Memory Interface: Connect the memory module to a suitable interface (e.g., DDR2 SDRAM controller) that supports the chip's specifications.
  • Data Transfer: Ensure proper data transfer between the K4H511638C-UCB3 and other components in your system, taking into account the chip's burst length and clock frequency.

K4H511638C-UCB3 Quality and Reliability

The K4H511638C-UCB3 is designed to meet the stringent requirements of high-performance computing applications. Its quality and reliability ensure consistent performance across a wide range of operational environments.

K4H511638C-UCB3 Ordering Information

The K4H511638C-UCB3 is available in tape and reel packaging, facilitating efficient assembly for high-volume production. Its product identification, including the temperature range and package type, is clearly specified for ease of ordering.

K4H511638C-UCB3 Package and Quality

The K4H511638C-UCB3 is housed in a compact, thermally efficient 66-pin FBGA package, making it suitable for space-constrained designs without compromising on thermal management or performance. The chip's quality ensures that each unit undergoes rigorous testing to meet stringent industrial and commercial standards.

Conclusion

The K4H511638C-UCB3 is an excellent choice for engineers seeking a reliable DDR2 SDRAM chip for high-performance computing applications. With its fast data transfer rates, low power consumption, and compact package, it is well-suited for various electronic devices across the industrial, commercial, and consumer sectors.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Pbfree Code Yes Rohs Code Yes
Part Life Cycle Code Obsolete ECCN Code EAR99
HTS Code ! 8542.32.00.28 Access Time-Max 0.7 ns
Clock Frequency-Max (fCLK) 166 MHz I/O Type COMMON
Interleaved Burst Length 2,4,8 JESD-30 Code R-PDSO-G66
JESD-609 Code e6 Memory Density 536870912 bit
Memory IC Type DDR1 DRAM Memory Width 16
Moisture Sensitivity Level 3 Number of Terminals 66
Number of Words 33554432 words Number of Words Code 32000000
Operating Temperature-Max 70 °C Organization 32MX16
Output Characteristics 3-STATE Package Body Material PLASTIC/EPOXY
Package Code TSSOP Package Equivalence Code TSSOP66,.46
Package Shape RECTANGULAR Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 Power Supplies ! 2.5 V
Qualification Status ! Not Qualified Refresh Cycles 8192
Sequential Burst Length 2,4,8 Standby Current-Max 0.005 A
Supply Current-Max 0.38 mA Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount ! YES Technology CMOS
Temperature Grade ! COMMERCIAL Terminal Finish TIN BISMUTH
Terminal Form ! GULL WING Terminal Pitch ! 0.635 mm
Terminal Position DUAL

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification K4H511638C-UCB3 PDF Download

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