K4B4G1646D-BCMA

High-performance computing relies on this modul
3,892 Effective Inventory

K4B4G1646D-BCMA

Effective Inventory3,892

High-performance computing relies on this modul

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Service & Packaging

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All Parts Extended Quality Guarantee

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K4B4G1646D-BCMA DataSheet
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K4B4G1646D-BCMA Description

The K4B4G1646D-BCMA is a high-performance DDR3 SDRAM chip from Samsung Electronics, designed for use in various electronic devices that require fast and reliable memory storage. This chip features 4Gb of memory capacity, a data transfer rate of up to 1600MHz, and low power consumption.

Pin Details

The K4B4G1646D-BCMA has a FBGA (Flip Chip Ball Grid Array) package with 90 pins. The pin configuration is as follows:

  • Pin 1-8: Address Input Pins
  • Pin 9-16: Data Input Pins
  • Pin 17-24: Command Input Pins
  • Pin 25-32: Clock Input Pins
  • Pin 33-40: Power Supply Pins
  • Pin 41-48: Ground Pins
  • Pin 49-56: VDDQ (Power Supply for DDR3 SDRAM)
  • Pin 57-64: VSSQ (Ground for DDR3 SDRAM)
  • Pin 65-72: DQ (Data Output Pins)
  • Pin 73-80: DQS (Data Strobe Pins)
  • Pin 81-88: DM (Mask Data Input Pins)
  • Pin 89-90: Reserved Pins

Features

  • 4Gb Memory Capacity: The K4B4G1646D-BCMA has a memory capacity of 4Gb, making it suitable for use in devices that require large amounts of storage.
  • Data Transfer Rate: This chip features a data transfer rate of up to 1600MHz, allowing for fast and efficient data transfer.
  • Low Power Consumption: The K4B4G1646D-BCMA has low power consumption, making it suitable for use in devices that require long battery life or reduced heat generation.

Applications

The K4B4G1646D-BCMA is suitable for use in a wide range of applications, including laptops, desktops, servers, and other electronic devices that require fast and reliable memory storage.

Where to Use:

  • Laptops: The K4B4G1646D-BCMA is suitable for use in laptops that require fast and reliable memory storage.
  • Desktops: This chip is also suitable for use in desktop computers that require large amounts of storage.
  • Servers: The K4B4G1646D-BCMA can be used in servers that require fast and reliable memory storage.

Manufacturer

The K4B4G1646D-BCMA is manufactured by Samsung Electronics, a leading global provider of semiconductor technology.

Packages

The K4B4G1646D-BCMA comes in an FBGA (Flip Chip Ball Grid Array) package with 90 pins.

Equivalent Parts of K4B4G1646D-BCMA

  • K4T1G144E9/86: A comparable DDR3 SDRAM chip from Samsung Electronics with similar features and performance.
  • Micron MT41J4G8NAE-125: An alternative DDR3 SDRAM chip from Micron Technology that offers equivalent functionality.

FAQ

Q: What is the memory capacity of the K4B4G1646D-BCMA?
A: The K4B4G1646D-BCMA has a memory capacity of 4Gb.

Q: What is the data transfer rate of the K4B4G1646D-BCMA?
A: The K4B4G1646D-BCMA features a data transfer rate of up to 1600MHz.

Q: Is the K4B4G1646D-BCMA suitable for use in laptops and desktops?
A: Yes, the K4B4G1646D-BCMA is suitable for use in laptops and desktops that require fast and reliable memory storage.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Manufacturer Samsung Product Category ! IC Chips

FAQs

What is K4B4G1646D-BCMA?

The K4B4G1646D-BCMA is a 4Gb (gigabit) DDR4 SDRAM (Synchronous Dynamic Random Access Memory) module designed and manufactured by Samsung. It is commonly used in computing devices, servers, and high-performance systems requiring high-speed and high-capacity memory.

How Does K4B4G1646D-BCMA Work?

The K4B4G1646D-BCMA works by providing high-speed access to stored data for the processor in various computing systems. It utilizes DDR4 technology to achieve faster data transfer rates and higher overall bandwidth compared to earlier DDR3 memory modules. The module's operational specifications adhere to industry standards set for DDR4 SDRAM.

How Many Pins does K4B4G1646D-BCMA have and What are the Functions of the Pinout Configuration?

The K4B4G1646D-BCMA is a 96-ball FBGA (Fine-pitch Ball Grid Array) package. The pinout configuration includes:

  • Data and Address Pins: Multiple pins for data input/output and address lines to enable communication with the memory module.
  • Power and Ground Pins: Pins for power supply and ground connection to ensure proper module operation and data integrity.
  • Clock and Control Pins: Pins for clock signals and control signals for synchronization and command execution.
  • DM Pins: Data Mask pins for write data masking during write operations.

What are the Pros and Cons of K4B4G1646D-BCMA?

Pros:

  • High-Speed Operation: DDR4 technology provides increased data transfer rates for improved system performance.
  • High Capacity: With 4Gb density, the module can provide high memory capacity for demanding applications.
  • Industry Standard: Adheres to DDR4 SDRAM industry standards for compatibility and reliability.
  • Robust Packaging: The FBGA package offers secure and reliable ball grid array connections for installation and operation.
  • Energy Efficiency: DDR4 technology offers improved energy efficiency compared to previous generations of memory.

Cons:

  • Cost: Higher density DDR4 modules may have higher cost compared to lower capacity alternatives.
  • Compatibility: Compatibility with older DDR3 or DDR2 systems may require specific motherboard support.

Are There Any Equivalents/Alternatives to K4B4G1646D-BCMA for Recommendation?

  • Similar DDR4 SDRAM modules include the Micron MT40A512M16JY-083E and the Hynix H5AN4G8NMFR-TFC.
  • Alternatives to the K4B4G1646D-BCMA include DDR4 modules from other manufacturers such as Micron, Hynix, and SK Hynix.

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