HY5PS1G831CFP-Y5

High-performance memory module for advanced computing applications
6,998 Effective Inventory

HY5PS1G831CFP-Y5

Effective Inventory6,998

High-performance memory module for advanced computing applications

  • Manufacturer Part # : HY5PS1G831CFP-Y5

  • Package/Case: BGA

  • Brand: SK Hynix

  • Product Categories : Controllers

Quality Assurance

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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WireTransfer

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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Example

Tape and Reel

Tape and Reel

Cut Tape

Cut Tape

Tube or Tray

Tube or Tray

HY5PS1G831CFP-Y5 DataSheet
no-price

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Interested Parts

Rapid Quote

Please submit RFQ for HY5PS1G831CFP-Y5 or email to us: Email: [email protected], we will contact you in 12 hours.

HY5PS1G831CFP-Y5 Description

The HY5PS1G831CFP-Y5 is a high-speed, low-power DDR2 SDRAM chip for use in computing devices. This device is designed to provide reliable and efficient memory storage solutions for various applications.

Pin Details

The HY5PS1G831CFP-Y5 is a 96-ball FBGA package with 1 Gbit DDR2 SDRAM capacity, operating at a clock speed of 533 MHz. It has a power supply voltage of 1.8V and an operational temperature range of -40°C to 95°C.

Features

  • High-speed operation: Supports high-speed data transfer rates for efficient memory access.
  • Low power consumption: Optimized for low power usage, ideal for battery-powered devices or energy-efficient systems.
  • Wide temperature range: Operates efficiently between -40°C and +95°C, making it suitable for various environmental conditions.
  • Auto refresh and self-refresh modes: Enables efficient memory management and power consumption reduction.

Applications

The HY5PS1G831CFP-Y5 is commonly used in PCs, laptops, mobile phones, tablets, e-readers, digital cameras, printers, scanners, networking equipment, IoT devices, automotive electronics, home entertainment systems, and medical devices.

Where to Use:

  • PCs and Laptops
  • Mobile Phones
  • Tablets and E-readers
  • Digital Cameras
  • Printers and Scanners
  • Networking Equipment
  • IoT Devices
  • Automotive Electronics
  • Home Entertainment Systems
  • Medical Devices

Manufacturer

The HY5PS1G831CFP-Y5 is manufactured by SK Hynix, a leading global semiconductor company.

Packages

The HY5PS1G831CFP-Y5 comes in a 96-ball FBGA package, designed for surface-mount technology and offering a compact and efficient solution for integrating the chip into electronic circuits.

Equivalent Parts of HY5PS1G831CFP-Y5

  • K4H512633F-BC30: A comparable DDR2 SDRAM chip from Micron Technology with similar features and performance.
  • M471K5123EH9-RD: An alternative DDR2 SDRAM chip from Samsung Electronics that offers equivalent functionality.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Rohs Code Yes Part Life Cycle Code Obsolete
Part Package Code BGA Pin Count ! 60
ECCN Code EAR99 HTS Code ! 8542.32.00.32
Access Mode ! MULTI BANK PAGE BURST Access Time-Max 0.45 ns
Additional Feature ! AUTO/SELF REFRESH Clock Frequency-Max (fCLK) 333 MHz
I/O Type COMMON Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B60 JESD-609 Code e1
Length 11.4 mm Memory Density 1073741824 bit
Memory IC Type DDR2 DRAM Memory Width 8
Number of Functions 1 Number of Ports ! 1
Number of Terminals 60 Number of Words 134217728 words
Number of Words Code 128000000 Operating Mode ! SYNCHRONOUS
Operating Temperature-Max 95 °C Organization 128MX8
Output Characteristics 3-STATE Package Body Material PLASTIC/EPOXY
Package Code TFBGA Package Equivalence Code BGA60,9X11,32
Package Shape RECTANGULAR Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Power Supplies ! 1.8 V Qualification Status ! Not Qualified
Refresh Cycles 8192 Seated Height-Max 1.2 mm
Self Refresh YES Sequential Burst Length 4,8
Supply Current-Max 0.18 mA Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount ! YES Technology CMOS
Temperature Grade ! OTHER Terminal Finish TIN SILVER COPPER
Terminal Form ! BALL Terminal Pitch ! 0.8 mm
Terminal Position BOTTOM Width 8 mm

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification HY5PS1G831CFP-Y5 PDF Download

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