HY5DU56822BT-J
DDR DRAM, 32MX8, 0.7ns, CMOS, PDSO66, 0.875 X 0.400 INCH, 0.65 MM PITCH, TSOP2-66HY5DU56822BT-J
DDR DRAM, 32MX8, 0.7ns, CMOS, PDSO66, 0.875 X 0.400 INCH, 0.65 MM PITCH, TSOP2-66
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
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HY5DU56822BT-J DataSheet

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HY5DU56822BT-J Description
The HY5DU56822BT-J is a 512Mb DDR2 SDRAM chip with a data transfer rate of 400MHz, designed for high-performance applications that require low power consumption and industrial temperature range support. This device is ideal for use in networking equipment, communication systems, and industrial applications that demand high-speed data transfer and reliability.
Pin Details
The HY5DU56822BT-J is a DDR2 SDRAM chip with 8 pins for half-duplex communication. It includes pins for receiving, driving, and enabling signals, along with power supply and ground connections.
Pin configuration
- Pin 1 (A0): Address Input 0
- Pin 2 (A1): Address Input 1
- Pin 3 (WE): Write Enable
- Pin 4 (CAS): Column Address Strobe
- Pin 5 (RAS): Row Address Strobe
- Pin 6 (DQ): Data Input/Output
- Pin 7 (VCC): Positive Power Supply
- Pin 8 (GND): Ground
Features
- 512Mb Capacity: Offers high storage capacity for demanding applications.
- 400MHz Data Transfer Rate: Enables fast data transfer and processing.
- Low Power Consumption: Optimized for low power usage, ideal for battery-powered devices.
- Industrial Temperature Range Support: Operates efficiently between -40°C and +125°C, allowing it to function reliably in various environmental conditions.
Applications
The HY5DU56822BT-J is designed for use in high-performance applications that require low power consumption and industrial temperature range support, such as networking equipment, communication systems, and industrial automation systems.
Where to Use:
This device can be used in various industries and applications, including:
- Networking equipment
- Communication systems
- Industrial automation systems
- Data centers
- Cloud computing infrastructure
Manufacturer
The HY5DU56822BT-J is manufactured by Hynix, a leading semiconductor company.
Packages
The HY5DU56822BT-J comes in an FBGA (Flip Chip Ball Grid Array) package, designed for surface-mount technology and offering a compact and efficient solution for integrating the chip into electronic circuits.
Equivalent Parts of HY5DU56822BT-J
- K4H512633E-HC30: A comparable DDR2 SDRAM chip from Micron Technology with similar features and performance.
- Micron MT41J512M8AH-125: An alternative DDR2 SDRAM chip from Micron Technology that offers equivalent functionality.
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Part Life Cycle Code | Obsolete | Part Package Code | TSOP2 |
Pin Count ! | 66 | ECCN Code | EAR99 |
HTS Code ! | 8542.32.00.24 | Access Mode ! | FOUR BANK PAGE BURST |
Access Time-Max | 0.7 ns | Additional Feature ! | AUTO/SELF REFRESH |
Clock Frequency-Max (fCLK) | 166 MHz | I/O Type | COMMON |
Interleaved Burst Length | 2,4,8 | JESD-30 Code | R-PDSO-G66 |
JESD-609 Code | e6 | Length | 22.225 mm |
Memory Density | 268435456 bit | Memory IC Type | DDR DRAM |
Memory Width | 8 | Number of Functions | 1 |
Number of Ports ! | 1 | Number of Terminals | 66 |
Number of Words | 33554432 words | Number of Words Code | 32000000 |
Operating Mode ! | SYNCHRONOUS | Operating Temperature-Max | 70 °C |
Organization | 32MX8 | Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY | Package Code | TSOP2 |
Package Equivalence Code | TSSOP66,.46 | Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE, THIN PROFILE | Power Supplies ! | 2.5 V |
Qualification Status ! | Not Qualified | Refresh Cycles | 8192 |
Seated Height-Max | 1.194 mm | Self Refresh | YES |
Sequential Burst Length | 2,4,8 | Supply Voltage-Max (Vsup) | 2.7 V |
Supply Voltage-Min (Vsup) | 2.3 V | Supply Voltage-Nom (Vsup) | 2.5 V |
Surface Mount ! | YES | Technology | CMOS |
Temperature Grade ! | COMMERCIAL | Terminal Finish | TIN BISMUTH |
Terminal Form ! | GULL WING | Terminal Pitch ! | 0.65 mm |
Terminal Position | DUAL | Width | 10.15 mm |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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Price details
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