HY5DU121622CTP-D43
DDR DRAM, 32MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 PITCH, ROHS COMPLIANT, TSOP2-66HY5DU121622CTP-D43
DDR DRAM, 32MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 PITCH, ROHS COMPLIANT, TSOP2-66
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HY5DU121622CTP-D43 DataSheet

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Interested Parts
HY5DU121622CTP-D43 Description
The HY5DU121622CTP-D43 is a high-performance DDR DRAM from SK Hynix Inc, designed for reliable data transmission in various applications. This device features 512Mx32bits DDR2 SDRAM with a clock speed of up to 667MHz and operates at a power supply voltage of 1.8V. It is housed in an 78-ball FBGA package, making it suitable for compact circuit designs.
Features
- 512Mx32bits DDR2 SDRAM: Offers high-performance data transmission with a clock speed of up to 667MHz.
- 1.8V Power Supply: Operates at a low power consumption voltage, ideal for battery-powered devices.
- JEDEC Standard: Compliant with JEDEC standard for reliable data transmission.
- 4 Banco Independent: Provides independent banks for efficient data access.
- Clock Support:667MHz: Supports high-speed clock frequencies for fast data transfer.
- 8K Refresh/64ms: Offers a refresh rate of 8K with a latency of 64ms for stable data transmission.
Applications
The HY5DU121622CTP-D43 is commonly used in various applications that require high-performance DDR DRAM, including personal computers, laptops, mobile devices, networking equipment, telecommunication systems, industrial control systems, automotive electronics, consumer electronics, medical devices, and military and aerospace applications.
Where to Use:
- Personal computers
- Laptops
- Mobile devices
- Networking equipment
- Telecommunication systems
- Industrial control systems
- Automotive electronics
- Consumer electronics
- Medical devices
- Military and aerospace applications
Manufacturer
The HY5DU121622CTP-D43 is manufactured by SK Hynix Inc, a global leader in semiconductor technology. It falls under the category of DDR DRAM components, which are designed to facilitate high-performance data transmission in various applications.
This product was developed to meet the growing demand for reliable and efficient data transmission in various industries, where features like high-speed clock frequencies, low power consumption, and JEDEC compliance are essential.
Packages
The HY5DU121622CTP-D43 comes in an 78-ball FBGA package. This package is designed for surface-mount technology, offering a compact and efficient solution for integrating the DDR DRAM into electronic circuits.

Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Pbfree Code | Yes | Rohs Code | Yes |
Part Life Cycle Code | Obsolete | Part Package Code | TSOP2 |
Pin Count ! | 66 | ECCN Code | EAR99 |
HTS Code ! | 8542.32.00.28 | Access Mode ! | FOUR BANK PAGE BURST |
Access Time-Max | 0.7 ns | Additional Feature ! | AUTO/SELF REFRESH |
Clock Frequency-Max (fCLK) | 200 MHz | I/O Type | COMMON |
Interleaved Burst Length | 2,4,8 | JESD-30 Code | R-PDSO-G66 |
JESD-609 Code | e6 | Length | 22.225 mm |
Memory Density | 536870912 bit | Memory IC Type | DDR1 DRAM |
Memory Width | 16 | Number of Functions | 1 |
Number of Ports ! | 1 | Number of Terminals | 66 |
Number of Words | 33554432 words | Number of Words Code | 32000000 |
Operating Mode ! | SYNCHRONOUS | Operating Temperature-Max | 70 °C |
Organization | 32MX16 | Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY | Package Code | TSOP2 |
Package Equivalence Code | TSSOP66,.46 | Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE, THIN PROFILE | Power Supplies ! | 2.6 V |
Qualification Status ! | Not Qualified | Refresh Cycles | 8192 |
Seated Height-Max | 1.194 mm | Self Refresh | YES |
Sequential Burst Length | 2,4,8 | Standby Current-Max | 0.01 A |
Supply Voltage-Max (Vsup) | 2.7 V | Supply Voltage-Min (Vsup) | 2.5 V |
Supply Voltage-Nom (Vsup) | 2.6 V | Surface Mount ! | YES |
Technology | CMOS | Temperature Grade ! | COMMERCIAL |
Terminal Finish | TIN BISMUTH | Terminal Form ! | GULL WING |
Terminal Pitch ! | 0.65 mm | Terminal Position | DUAL |
Width | 10.16 mm |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
FAQs
What is HY5DU121622CTP-D43?
The HY5DU121622CTP-D43 is a 512Mb Double Data Rate 2 (DDR2) Synchronous Dynamic Random Access Memory (SDRAM) chip designed by SK Hynix. It is commonly used in computing systems, networking equipment, and consumer electronics for high-speed data storage and retrieval.
How Does HY5DU121622CTP-D43 Work?
The HY5DU121622CTP-D43 works by storing and retrieving digital data with high speed and efficiency. It utilizes double data rate architecture to transfer data on both the rising and falling edges of the clock signal, effectively doubling the data transfer rate. The SDRAM chip is synchronized with the system clock to ensure accurate and timely data operations.
How Many Pins does HY5DU121622CTP-D43 have and What are the Functions of the Pinout Configuration?
The HY5DU121622CTP-D43 is housed in a 84-ball FBGA (Fine-pitch Ball Grid Array) package. The pinout configuration includes:
- VDD, VDDQ: Power supply pins for core and I/O, respectively.
- VSS, VSSQ: Ground pins for core and I/O, respectively.
- DQ, DM: Data input/output and data mask pins.
- CLK, /CLK: Clock input and its complement.
- CS, /CS: Chip select input and its complement.
- WE, /CAS, /RAS: Write enable, column address strobe, and row address strobe inputs.
- BA0-BA2: Bank address inputs.
- ODT: On-die termination control.
What are the Pros and Cons of HY5DU121622CTP-D43?
Pros:
- High-Speed Operation: Provides high-speed data transfer suitable for demanding applications.
- Double Data Rate: Utilizes DDR2 architecture for efficient data transfer on both clock edges.
- Large Capacity: Offers 512Mb storage capacity for storing significant amounts of data.
- Synchronous Interface: Synchronizes with the system clock for accurate and reliable operation.
- Compact Form Factor: The FBGA package allows for space-efficient placement on PCBs.
Cons:
- Component Matching: Requires careful PCB layout and signal integrity considerations for optimal performance.
- Complex Initialization: DDR2 SDRAM initialization sequence may be more complex compared to older SDRAM types.
- Power Consumption: Higher speed operation may result in relatively higher power consumption.
Are There Any Equivalents/Alternatives to HY5DU121622CTP-D43 for Recommendation?
- The MT47H64M16HR-3 from Micron Technology is a comparable DDR2 SDRAM chip with similar specifications.
- Possible alternatives to the HY5DU121622CTP-D43 include the K4T51163QJ-BCE7 from Samsung and the H5PS5162GFR-S6C from SK Hynix.
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