HY57V561620FTP-H
The HY57V561620FTP-H is a high-speed, low-power dynamic random-access memory (DRAM) chip with a capacity of 512 megabitsHY57V561620FTP-H
The HY57V561620FTP-H is a high-speed, low-power dynamic random-access memory (DRAM) chip with a capacity of 512 megabits
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HY57V561620FTP-H DataSheet

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Interested Parts
HY57V561620FTP-H Description
The HY57V561620FTP-H is a high-speed CMOS synchronous DRAM from SK Hynix Inc, designed for use in various applications that require fast and reliable memory solutions. This device features 64Mbit capacity with 4Mbit x 16 organization, making it suitable for embedded systems, networking equipment, personal computers, laptops, servers, printers, telecommunication equipment, and industrial applications.
Pin Details
The HY57V561620FTP-H is a synchronous DRAM with 54 pins for half-duplex communication. It includes pins for receiving, driving, and enabling signals, along with power supply and ground connections.
Pin configuration
- Pin 1 (A0): Address Input 0
- Pin 2 (A1): Address Input 1
- Pin 3 (A2): Address Input 2
- Pin 4 (WE): Write Enable
- Pin 5 (OE): Output Enable
- Pin 6 (BS): Byte Select
- Pin 7 (CAS): Column Address Strobe
- Pin 8 (RAS): Row Address Strobe
- Pin 9 (DQ0-DQ15): Data Input/Output
- Pin 10-53: Ground and Power Supply Connections
Features
The HY57V561620FTP-H features a high-speed CMOS synchronous DRAM with the following characteristics:
- 64Mbit capacity with 4Mbit x 16 organization
- Fast access times: 55ns (typical) for read and write operations
- Low power consumption: 1.2V, 0.5A (typical)
- High-speed interface: supports up to 66MHz clock frequency
- Robust design: withstands various environmental conditions and stress tests
Applications
The HY57V561620FTP-H is suitable for use in a wide range of applications, including embedded systems, networking equipment, personal computers, laptops, servers, printers, telecommunication equipment, and industrial applications.
Where to Use:
This device can be used in various industries and applications, such as:
- Embedded systems: automotive, industrial control, medical devices, etc.
- Networking equipment: routers, switches, modems, etc.
- Personal computers: laptops, desktops, servers, etc.
- Printers: inkjet, laser, dot matrix, etc.
- Telecommunication equipment: base stations, routers, switches, etc.
Manufacturer
The HY57V561620FTP-H is manufactured by SK Hynix Inc, a leading global semiconductor company.
Packages
The HY57V561620FTP-H comes in a 54-pin FBGA (Flip Chip Ball Grid Array) package, which provides a compact and efficient solution for integrating the device into electronic circuits.
Equivalent Parts of HY57V561620FTP-H
- Micron MT48LC8M16A2: A comparable synchronous DRAM from Micron Technology, Inc. with similar features and performance.
- Samsung K4S281616I7: An alternative synchronous DRAM from Samsung Electronics Co., Ltd. that offers equivalent functionality.

Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Pbfree Code | Yes | Rohs Code | Yes |
Part Life Cycle Code | Obsolete | Part Package Code | TSOP2 |
Pin Count ! | 54 | ECCN Code | EAR99 |
HTS Code ! | 8542.32.00.24 | Access Mode ! | FOUR BANK PAGE BURST |
Access Time-Max | 5.4 ns | Additional Feature ! | AUTO/SELF REFRESH |
Clock Frequency-Max (fCLK) | 133 MHz | I/O Type | COMMON |
Interleaved Burst Length | 1,2,4,8 | JESD-30 Code | R-PDSO-G54 |
JESD-609 Code | e6 | Length | 22.22 mm |
Memory Density | 268435456 bit | Memory IC Type | SYNCHRONOUS DRAM |
Memory Width | 16 | Number of Functions | 1 |
Number of Ports ! | 1 | Number of Terminals | 54 |
Number of Words | 16777216 words | Number of Words Code | 16000000 |
Operating Mode ! | SYNCHRONOUS | Operating Temperature-Max | 70 °C |
Organization | 16MX16 | Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY | Package Code | TSOP2 |
Package Equivalence Code | TSOP54,.46,32 | Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE, THIN PROFILE | Peak Reflow Temperature (Cel) | 260 |
Power Supplies ! | 3.3 V | Qualification Status ! | Not Qualified |
Refresh Cycles | 8192 | Seated Height-Max | 1.2 mm |
Self Refresh | YES | Sequential Burst Length | 1,2,4,8,FP |
Standby Current-Max | 0.001 A | Supply Current-Max | 0.17 mA |
Supply Voltage-Max (Vsup) | 3.6 V | Supply Voltage-Min (Vsup) | 3 V |
Supply Voltage-Nom (Vsup) | 3.3 V | Surface Mount ! | YES |
Technology | CMOS | Temperature Grade ! | COMMERCIAL |
Terminal Finish | Tin/Bismuth (Sn/Bi) | Terminal Form ! | GULL WING |
Terminal Pitch ! | 0.8 mm | Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | 20 | Width | 10.16 mm |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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Price details
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