HY27UF081G2M

HY27UF081G2M is a high-performance and high-capacity NAND flash memory chip for various applications.
5,376 Effective Inventory

HY27UF081G2M

Effective Inventory5,376

HY27UF081G2M is a high-performance and high-capacity NAND flash memory chip for various applications.

  • Manufacturer Part # : HY27UF081G2M

  • Package/Case: TSOP48

  • Brand: SK Hynix

  • Product Categories : Memory

Quality Assurance

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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HY27UF081G2M DataSheet
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Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

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Rapid Quote

Please submit RFQ for HY27UF081G2M or email to us: Email: [email protected], we will contact you in 12 hours.

HY27UF081G2M Description

The HY27UF081G2M is an 8Gb density NAND flash memory chip from SK Hynix Inc, designed for various applications that require high-performance and reliability. This device features single-level cell (SLC) architecture, a 3V power supply, fast read and program time, high-reliability, low power consumption, and industrial temperature range, making it suitable for automotive applications.

Features

  • 8Gb density: Offers high storage capacity for various applications.
  • NAND Flash memory: Provides reliable and fast data storage and retrieval.
  • Single-level cell (SLC) architecture: Ensures high-reliability and low power consumption.
  • 3V power supply: Operates efficiently with a single power source.
  • Fast read and program time: Enables quick data access and storage.
  • High-reliability: Ensures stable operation in various environments.
  • Low power consumption: Optimized for low power usage, ideal for battery-powered devices.
  • Industrial temperature range: Operates efficiently between -40°C and +125°C.

Applications

The HY27UF081G2M is suitable for various applications that require high-performance and reliability, including automotive systems.

Where to Use:

  • Automotive systems
  • Industrial control systems
  • Data storage devices
  • Battery-powered devices

Manufacturer

The HY27UF081G2M is manufactured by SK Hynix Inc, a global leader in semiconductor technology.

Packages

The HY27UF081G2M comes in a variety of packages, including BGA (Ball Grid Array) and FBGA (Fine Pitch Ball Grid Array).

Equivalent Parts of HY27UF081G2M

  • Micron MT61J256M8PK: A comparable NAND flash memory chip with similar features and performance.
  • Samsung K9HGG08U1M: An alternative NAND flash memory chip that offers equivalent functionality.

FAQ

Q: What is the storage capacity of the HY27UF081G2M?
A: It has an 8Gb density, offering high storage capacity for various applications.

Q: How does the HY27UF081G2M handle power consumption?
A: It is designed to operate efficiently with a single power source and optimized for low power usage, ideal for battery-powered devices.

Q: Can the HY27UF081G2M be used in automotive systems?
A: Yes, it is suitable for various applications that require high-performance and reliability, including automotive systems.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Part Life Cycle Code Obsolete ECCN Code EAR99
HTS Code ! 8542.32.00.51

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification HY27UF081G2M PDF Download

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