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HY27UF081G2A-TPCB
HY27UF081G2A-TPCB is a NAND Flash memory chipHY27UF081G2A-TPCB
HY27UF081G2A-TPCB is a NAND Flash memory chip
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Service & Packaging
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HY27UF081G2A-TPCB DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
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HY27UF081G2A-TPCB Details
The HY27UF081G2A-TPCB is a NAND flash memory chip manufactured by Hynix Semiconductor. It belongs to the NAND flash memory family, featuring a capacity of 1 gigabit (Gb) or 128 megabytes (MB). The "G2A" in its name indicates its second generation architecture, which typically implies improvements in performance and efficiency over previous generations. The "TPCB" suffix refers to the package type and interface of the chip, where "TP" signifies a thin small outline package (TSOP) and "CB" denotes the ball grid array (BGA) interface. This package and interface combination is commonly used in embedded systems and consumer electronics due to its compact size and solderable connections, enabling easy integration onto printed circuit boards. The HY27UF081G2A-TPCB operates at standard voltages and temperatures, making it suitable for a wide range of applications such as smartphones, tablets, solid-state drives (SSDs), and industrial devices requiring non-volatile storage
Key Features
- 8 Gbit density
- NAND Flash memory type
- 3.3V power supply
- 1.8V/3.3V interface
- Execute in place (XIP) supported
- Advanced data protection features
- Multi-plane architecture for high data throughput
- Industrial temperature range (-40°C to 85°C)
- 16-bit I/O bus interface
- Flexible block architecture
Application
- Consumer electronics
- Smartphones
- Tablets
- PCs/laptops
- Automobiles
- Industrial equipment
- Medical devices
- Networking devices
- Gaming consoles
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
| Pbfree Code | Yes | Rohs Code | Yes |
| Part Life Cycle Code | Obsolete | Part Package Code | TSOP1 |
| Pin Count ! | 48 | Reach Compliance Code | |
| ECCN Code | EAR99 | HTS Code ! | 8542.32.00.51 |
| Access Time-Max | 25000 ns | Command User Interface | YES |
| Data Polling | NO | JESD-30 Code | R-PDSO-G48 |
| JESD-609 Code | e6 | Length | 18.4 mm |
| Memory Density | 1073741824 bit | Memory IC Type | FLASH |
| Memory Width | 8 | Moisture Sensitivity Level | 3 |
| Number of Functions | 1 | Number of Sectors/Size | 1K |
| Number of Terminals | 48 | Number of Words | 134217728 words |
| Number of Words Code | 128000000 | Operating Mode ! | ASYNCHRONOUS |
| Operating Temperature-Max | 70 °C | Operating Temperature-Min | |
| Organization | 128MX8 | Package Body Material | PLASTIC/EPOXY |
| Package Code | TSOP1 | Package Equivalence Code | TSSOP48,.8,20 |
| Package Shape | RECTANGULAR | Package Style | SMALL OUTLINE, THIN PROFILE |
| Page Size | 2K words | Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | 260 | Power Supplies ! | 3.3 V |
| Programming Voltage ! | 3.3 V | Qualification Status ! | Not Qualified |
| Ready/Busy | YES | Seated Height-Max | 1.2 mm |
| Sector Size | 128K | Standby Current-Max | 0.00005 A |
| Supply Current-Max | 0.03 mA | Supply Voltage-Max (Vsup) | 3.6 V |
| Supply Voltage-Min (Vsup) | 2.7 V | Supply Voltage-Nom (Vsup) | 3.3 V |
| Surface Mount ! | YES | Technology | CMOS |
| Temperature Grade ! | COMMERCIAL | Terminal Finish | TIN BISMUTH |
| Terminal Form ! | GULL WING | Terminal Pitch ! | 0.5 mm |
| Terminal Position | DUAL | Time@Peak Reflow Temperature-Max (s) | 30 |
| Toggle Bit | NO | Type | SLC NAND TYPE |
| Width | 12 mm |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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