HY27UF081G2A-TPCB

Name: HY27UF081G2A-TPCB
Brand: SK Hynix
Rating: 4.5 (10 reviews)
Author: Lisleapex

HY27UF081G2A-TPCB is a NAND Flash memory chip

6,409 Effective Inventory

HY27UF081G2A-TPCB

Effective Inventory6,409

HY27UF081G2A-TPCB is a NAND Flash memory chip

Manufacturer Part # : HY27UF081G2A-TPCB
Package/Case: TSOP-48
Brand: SK Hynix
Product Categories : Memory

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

Example

Tape and Reel

Cut Tape

Tube or Tray

HY27UF081G2A-TPCB DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

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Rapid Quote

Please submit RFQ for HY27UF081G2A-TPCB or email to us: Email: [email protected], we will contact you in 12 hours.

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HY27UF081G2A-TPCB Description

The HY27UF081G2A-TPCB is a high-density NAND flash memory chip from SK Hynix Inc, designed for use in various applications that require reliable and efficient data storage. This device features 8 Gbit density, making it suitable for use in consumer electronics, industrial equipment, and other devices where high-capacity storage is required.

Pin Details

The HY27UF081G2A-TPCB has a standard TSOP1-48 package with 48 pins. The pin configuration includes:

Pin 1 (VCC): Positive Power Supply
Pin 2 (GND): Ground
Pin 3-47: Data I/O Bus
Pin 48 (WP): Write Protect

Features

8 Gbit density: Provides high-capacity storage for large amounts of data.
NAND Flash memory type: Offers reliable and efficient data storage.
3.3V power supply: Operates on a standard voltage, making it suitable for use in a wide range of applications.
1.8V/3.3V interface: Supports both low-voltage and high-voltage interfaces for compatibility with various devices.
Execute in place (XIP) supported: Enables fast and efficient data processing.
Advanced data protection features: Provides reliable data storage and protection against errors and corruption.

Applications

The HY27UF081G2A-TPCB is suitable for use in a wide range of applications, including consumer electronics, industrial equipment, automotive systems, and more.

Where to Use:

Consumer electronics: Smartphones, tablets, laptops, and other devices that require high-capacity storage.
Industrial equipment: Industrial control systems, automation systems, and other devices that require reliable data storage.
Automotive systems: In-car entertainment systems, navigation systems, and other automotive applications that require high-capacity storage.

Manufacturer

The HY27UF081G2A-TPCB is manufactured by SK Hynix Inc, a leading global semiconductor company.

Packages

The HY27UF081G2A-TPCB comes in a standard TSOP1-48 package with 48 pins.

Equivalent Parts of HY27UF081G2A-TPCB

Micron MT29F512ABAEM: A comparable NAND flash memory chip from Micron Technology, Inc.
Samsung K9HGY8U1M: An alternative NAND flash memory chip from Samsung Electronics Co., Ltd.

FAQ

Q: What is the capacity of the HY27UF081G2A-TPCB?
A: The device has a capacity of 8 Gbit, making it suitable for use in applications that require high-capacity storage.

Q: Can the HY27UF081G2A-TPCB be used in industrial equipment?
A: Yes, the device is designed to operate reliably in a wide range of temperatures and environments, making it suitable for use in industrial equipment and other applications that require high-capacity storage.

Q: Is the HY27UF081G2A-TPCB compatible with 1.8V interfaces?
A: Yes, the device supports both low-voltage (1.8V) and high-voltage (3.3V) interfaces, making it compatible with a wide range of devices and systems.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Pbfree Code	Yes	Rohs Code	Yes
Part Life Cycle Code	Obsolete	Part Package Code	TSOP1
Pin Count !	48	ECCN Code	EAR99
HTS Code !	8542.32.00.51	Access Time-Max	25000 ns
Command User Interface	YES	Data Polling	NO
JESD-30 Code	R-PDSO-G48	JESD-609 Code	e6
Length	18.4 mm	Memory Density	1073741824 bit
Memory IC Type	FLASH	Memory Width	8
Moisture Sensitivity Level	3	Number of Functions	1
Number of Sectors/Size	1K	Number of Terminals	48
Number of Words	134217728 words	Number of Words Code	128000000
Operating Mode !	ASYNCHRONOUS	Operating Temperature-Max	70 °C
Organization	128MX8	Package Body Material	PLASTIC/EPOXY
Package Code	TSOP1	Package Equivalence Code	TSSOP48,.8,20
Package Shape	RECTANGULAR	Package Style	SMALL OUTLINE, THIN PROFILE
Page Size	2K words	Parallel/Serial	PARALLEL
Peak Reflow Temperature (Cel)	260	Power Supplies !	3.3 V
Programming Voltage !	3.3 V	Qualification Status !	Not Qualified
Ready/Busy	YES	Seated Height-Max	1.2 mm
Sector Size	128K	Standby Current-Max	0.00005 A
Supply Current-Max	0.03 mA	Supply Voltage-Max (Vsup)	3.6 V
Supply Voltage-Min (Vsup)	2.7 V	Supply Voltage-Nom (Vsup)	3.3 V
Surface Mount !	YES	Technology	CMOS
Temperature Grade !	COMMERCIAL	Terminal Finish	TIN BISMUTH
Terminal Form !	GULL WING	Terminal Pitch !	0.5 mm
Terminal Position	DUAL	Time@Peak Reflow Temperature-Max (s)	30
Toggle Bit	NO	Type	SLC NAND TYPE
Width	12 mm

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification HY27UF081G2A-TPCB PDF Download