H5TQ4G63CFR-RDC

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  • Manufacturer Part # : H5TQ4G63CFR-RDC

  • Package/Case: FBGA-96

  • Part Status : OBSOLETE

  • Brand: SK Hynix

  • Product Categories : Memory

  • RoHS:

Quality Assurance

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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Cut Tape

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H5TQ4G63CFR-RDC DataSheet

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Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Interested Parts

Rapid Quote

Please submit RFQ for H5TQ4G63CFR-RDC or email to us: Email: [email protected], we will contact you in 12 hours.

H5TQ4G63CFR-RDC Description

The H5TQ4G63CFR-RDC is a high-performance DDR3 DRAM chip from Hynix, designed for optimal use in tablets and other portable devices. This device features low power consumption, compact size, and high speed, making it an ideal solution for space-saving technology.

Pin Details

The H5TQ4G63CFR-RDC is a 96-pin FBGA (Flip Chip Ball Grid Array) package DRAM chip with the following pin configuration:

  • Size: 4GB
  • Type: DDR3
  • Speed: 1866MHz
  • Configuration: 512M x 64
  • Organization: 8 banks, 8 banks/group
  • Low power consumption
  • Clock frequency: 933MHz
  • Operating temperature range: -40°C to 85°C

Features

  • Size: 4GB: Offers a large storage capacity for demanding applications.
  • Type: DDR3: Provides high-speed data transfer and low power consumption.
  • Speed: 1866MHz: Enables fast data transfer rates for efficient system performance.
  • Configuration: 512M x 64: Offers a high level of parallelism for improved memory access times.
  • Organization: 8 banks, 8 banks/group: Provides efficient bank switching and reduced power consumption.
  • Low power consumption: Optimized for low power usage, ideal for battery-powered devices.
  • Clock frequency: 933MHz: Enables high-speed data transfer and processing.
  • Operating temperature range: -40°C to 85°C: Allows reliable operation across a wide temperature range.

Applications

This device is designed for use in tablets, laptops, and other portable devices that require high-performance memory with low power consumption.

Where to Use:

  • Tablets: Ideal for demanding applications such as gaming and video editing.
  • Laptops: Provides fast data transfer rates and efficient system performance.
  • Portable devices: Optimized for low power consumption, making it suitable for battery-powered devices.

Manufacturer

The H5TQ4G63CFR-RDC is manufactured by Hynix, a leading provider of semiconductor components and solutions.

Packages

This device comes in a 96-pin FBGA (Flip Chip Ball Grid Array) package, designed for surface-mount technology and offering a compact and efficient solution for integrating the DRAM chip into electronic circuits.

FAQ

Q: What is the operating temperature range of the H5TQ4G63CFR-RDC?
A: It operates within a wide temperature range of -40°C to 85°C, allowing it to function reliably in various environmental conditions.

Q: How does the H5TQ4G63CFR-RDC handle power consumption?
A: It is designed with low power consumption features, optimized for efficient system performance and reduced battery drain.

Q: Can the H5TQ4G63CFR-RDC be used in portable devices?
A: Yes, it is specifically designed for use in tablets, laptops, and other portable devices that require high-performance memory with low power consumption.

H5TQ4G63CFR-RDC

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

ECCN (US) EAR99 Part Status ! Obsolete
Automotive No PPAP No
DRAM Type DDR3 SDRAM Chip Density (bit) 4G
Organization 256Mx16 Number of Internal Banks 8
Number of Words per Bank 32M Number of Bits/Word (bit) 16
Data Bus Width (bit) 16 Maximum Clock Rate (MHz) 1866
Address Bus Width (bit) 18 Process Technology CMOS
Minimum Operating Supply Voltage (V) 1.425 Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 156 Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95 Supplier Temperature Grade Commercial
Number of I/O Lines (bit) 16 Mounting Surface Mount
Package Height 0.76 Package Width 7.5
Package Length 13 PCB changed 96
Standard Package Name BGA Supplier Package FBGA
Pin Count ! 96 Lead Shape Ball

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