H5TQ4G63AFR-PBI

Name: H5TQ4G63AFR-PBI
Rating: 4.5 (10 reviews)
Author: Lisleapex

High-density DDR DRAM module for efficient data transfe

2,194 Effective Inventory

H5TQ4G63AFR-PBI

Effective Inventory2,194

High-density DDR DRAM module for efficient data transfe

Manufacturer Part # : H5TQ4G63AFR-PBI
Brand: Sk Hynix Inc
Product Categories : Memory

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

Example

Tape and Reel

Cut Tape

Tube or Tray

H5TQ4G63AFR-PBI DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

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Rapid Quote

Please submit RFQ for H5TQ4G63AFR-PBI or email to us: Email: [email protected], we will contact you in 12 hours.

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H5TQ4G63AFR-PBI Details

Introduction to H5TQ4G63AFR-PBI

The H5TQ4G63AFR-PBI is a high-speed and low-power mobile DRAM (mDRAM) IC manufactured by SK Hynix. This IC is designed to meet the requirements of mobile and portable devices, offering efficient memory performance with low power consumption. With a capacity of 4Gb (512M x 8), the H5TQ4G63AFR-PBI provides fast data access and transfer rates, making it suitable for use in smartphones, tablets, and other handheld electronic devices.

Specs and Features

Memory Type: Mobile DRAM (mDRAM) with high-speed and low-power operation.
Organization: 512M x 8 configuration for efficient data handling in mobile applications.
Operating Speed: High-speed operation for seamless multitasking and data-intensive tasks.
Low Power Consumption: Designed for energy-efficient performance to prolong battery life in mobile devices.
Package Type: Available in compact and thin BGA (Ball Grid Array) package for space-constrained designs.
Temperature Range: Supports extended temperature range for reliable performance in various operating environments.

Application and Uses

The H5TQ4G63AFR-PBI is ideal for memory-intensive applications in mobile devices:

Smartphones and Tablets: Used for high-performance memory storage and efficient multitasking capabilities in mobile devices.
Portable Media Players: Applied in handheld entertainment devices for smooth video playback and responsive user interfaces.
Handheld Gaming Consoles: Integrated into gaming devices for quick data access and seamless gaming experiences.
Wearable Technology: Utilized in smartwatches and fitness trackers for energy-efficient memory management and data handling.

Equivalent Part

For similar functionalities, consider these alternatives to the H5TQ4G63AFR-PBI:

MT53B256M32D1: Mobile LPDDR4 SDRAM IC offering high-speed and low-power memory solution for mobile applications.
K3QF6F60MM-AGCF: Low-power mobile SDRAM IC with compact BGA package for space-constrained mobile designs.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Rohs Code	Yes	Part Life Cycle Code	Obsolete
Ihs Manufacturer	SK HYNIX INC	Part Package Code	BGA
Package Description	TFBGA, BGA96,9X16,32	Pin Count !	96
ECCN Code	EAR99	HTS Code !	8542.32.00.36
Access Mode !	MULTI BANK PAGE BURST	Access Time-Max	0.225 ns
Additional Feature !	AUTO/SELF REFRESH	Clock Frequency-Max (fCLK)	800 MHz
I/O Type	COMMON	Interleaved Burst Length	4,8
JESD-30 Code	R-PBGA-B96	Length	13 mm
Memory Density	4294967296 bit	Memory IC Type	DDR3L DRAM
Memory Width	16	Number of Functions	1
Number of Ports !	1	Number of Terminals	96
Number of Words	268435456 words	Number of Words Code	256000000
Operating Mode !	SYNCHRONOUS	Operating Temperature-Max	85 °C
Operating Temperature-Min	-40 °C	Organization	256MX16
Output Characteristics	3-STATE	Package Body Material	PLASTIC/EPOXY
Package Code	TFBGA	Package Equivalence Code	BGA96,9X16,32
Package Shape	RECTANGULAR	Package Style	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)	NOT SPECIFIED	Power Supplies !	1.5 V
Qualification Status !	Not Qualified	Refresh Cycles	8192
Seated Height-Max	1.2 mm	Self Refresh	YES
Sequential Burst Length	4,8	Standby Current-Max	0.017 A
Supply Current-Max	0.22 mA	Supply Voltage-Max (Vsup)	1.45 V
Supply Voltage-Min (Vsup)	1.283 V	Supply Voltage-Nom (Vsup)	1.35 V
Surface Mount !	YES	Technology	CMOS
Temperature Grade !	INDUSTRIAL	Terminal Form !	BALL
Terminal Pitch !	0.8 mm	Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED	Width	9 mm