H5TQ1G63DFR-H9C
DDR DRAM, 64MX16, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96H5TQ1G63DFR-H9C
DDR DRAM, 64MX16, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96
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Manufacturer Part # : H5TQ1G63DFR-H9C
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Package/Case: BGA-96
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Brand: SKHYNIX
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Product Categories : Controllers
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.






Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.








About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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Cut Tape

Tube or Tray
H5TQ1G63DFR-H9C DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Interested Parts
H5TQ1G63DFR-H9C Details
The H5TQ1G63DFR-H9C is a high-performance synchronous DDR3L SDRAM chip manufactured by SK Hynix. It features an 8Gb LPDDR3 memory chip with 4Gb x 2 banks organization, offering high performance and low power consumption.
This high-speed memory solution operates at a speed of 1866Mbps, making it suitable for high-bandwidth applications such as mobile devices, tablets, and other consumer electronics. The H5TQ1G63DFR-H9C is designed to provide reliable performance and improved power efficiency, making it an ideal choice for various industrial IoT, automotive, and networking device applications.
H5TQ1G63DFR-H9C Key Features
- 8Gb LPDDR3 memory chip with 4Gb x 2 banks organization
- High-performance and low power consumption
- Operates at a speed of 1866Mbps
- Suitable for high-bandwidth applications such as mobile devices, tablets, and other consumer electronics
- Ideal for industrial IoT, automotive, and networking device applications
H5TQ1G63DFR-H9C Product Usage
The H5TQ1G63DFR-H9C is a high-performance DDR3L SDRAM chip designed to provide reliable performance and improved power efficiency. Some typical applications and circuits that use the H5TQ1G63DFR-H9C include:
Consumer Electronics:
- Mobile devices, tablets, and other consumer electronics
- Smart home appliances and IoT devices
- Automotive infotainment systems and telematics platforms
H5TQ1G63DFR-H9C Circuit Diagram
A sample circuit diagram using the H5TQ1G63DFR-H9C might involve:
- Power Supply: Connect a suitable voltage supply (within the operational range) to the Vcc pin.
- Data Signals: Connect the data signals (DQ0-DQ31) to the corresponding pins on the memory chip.
- Address Signals: Connect the address signals (A0-A12) to the corresponding pins on the memory chip.
- Control Signals: Apply control signals (CK, CK#, RAS, CAS, WE) as required by the memory chip's specifications.
H5TQ1G63DFR-H9C Quality and Reliability
SK Hynix's commitment to quality ensures that the H5TQ1G63DFR-H9C is reliable and performs consistently. It is designed to meet the stringent requirements of industrial and commercial applications, where consistent operation and long service life are critical.
H5TQ1G63DFR-H9C Ordering Information
The H5TQ1G63DFR-H9C is available in tape and reel packaging, facilitating efficient assembly for high-volume production. Its product identification, including the temperature range and package type, is clearly specified for ease of ordering.
H5TQ1G63DFR-H9C Package and Quality
The H5TQ1G63DFR-H9C is housed in a compact, thermally efficient package, making it suitable for space-constrained designs without compromising on thermal management or performance. SK Hynix ensures that each unit undergoes rigorous testing to meet stringent industrial and commercial standards. This emphasis on quality guarantees that the H5TQ1G63DFR-H9C delivers dependable, long-term performance across a wide range of operational environments.
Conclusion
The H5TQ1G63DFR-H9C from SK Hynix is an ideal choice for engineers seeking a high-performance DDR3L SDRAM chip for various industrial IoT, automotive, and networking device applications. With its reliable performance, improved power efficiency, and compact package, it is well-suited for demanding memory-intensive applications.
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Rohs Code | Yes | Part Life Cycle Code | Obsolete |
Part Package Code | BGA | Pin Count ! | 96 |
ECCN Code | EAR99 | HTS Code ! | 8542.32.00.32 |
Access Mode ! | MULTI BANK PAGE BURST | Additional Feature ! | AUTO/SELF REFRESH |
Clock Frequency-Max (fCLK) | 667 MHz | I/O Type | COMMON |
Interleaved Burst Length | 4,8 | JESD-30 Code | R-PBGA-B96 |
JESD-609 Code | e1 | Length | 13 mm |
Memory Density | 1073741824 bit | Memory IC Type | DDR3 DRAM |
Memory Width | 16 | Number of Functions | 1 |
Number of Ports ! | 1 | Number of Terminals | 96 |
Number of Words | 67108864 words | Number of Words Code | 64000000 |
Operating Mode ! | SYNCHRONOUS | Operating Temperature-Max | 85 °C |
Organization | 64MX16 | Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY | Package Code | TFBGA |
Package Equivalence Code | BGA96,9X16,32 | Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | 260 |
Power Supplies ! | 1.5 V | Qualification Status ! | Not Qualified |
Refresh Cycles | 8192 | Seated Height-Max | 1.2 mm |
Self Refresh | YES | Sequential Burst Length | 4,8 |
Standby Current-Max | 0.01 A | Supply Current-Max | 0.2 mA |
Supply Voltage-Max (Vsup) | 1.575 V | Supply Voltage-Min (Vsup) | 1.425 V |
Supply Voltage-Nom (Vsup) | 1.5 V | Surface Mount ! | YES |
Technology | CMOS | Temperature Grade ! | OTHER |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | Terminal Form ! | BALL |
Terminal Pitch ! | 0.8 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 20 | Width | 7.5 mm |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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Price details
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