H5TQ1G63DFR-11C

Name: H5TQ1G63DFR-11C
Rating: 4.5 (10 reviews)
Author: Lisleapex

High-density DDR DRAM module for industrial application

4,985 Effective Inventory

H5TQ1G63DFR-11C

Effective Inventory4,985

High-density DDR DRAM module for industrial application

Manufacturer Part # : H5TQ1G63DFR-11C
Brand: Sk Hynix Inc
Product Categories : Memory

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

Example

Tape and Reel

Cut Tape

Tube or Tray

H5TQ1G63DFR-11C DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

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Rapid Quote

Please submit RFQ for H5TQ1G63DFR-11C or email to us: Email: [email protected], we will contact you in 12 hours.

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H5TQ1G63DFR-11C Details

Introduction to H5TQ1G63DFR-11C

The H5TQ1G63DFR-11C is a high-speed CMOS Mobile DDR (Double Data Rate) SDRAM manufactured by SK Hynix. This SDRAM is designed to provide high-speed and efficient memory performance for mobile and embedded applications. With a capacity of 1 Gigabit (1 Gb) and a data rate of 1.6 Gbps, the H5TQ1G63DFR-11C offers reliable and power-efficient memory solutions for mobile devices, automotive electronics, and other space-constrained systems.

Specs and Features

Memory Type: Mobile DDR SDRAM offering high-speed data transfer for mobile and embedded applications.
Capacity: 1 Gb capacity for storing a large amount of data in a compact form factor.
Data Rate: 1.6 Gbps data rate for rapid data access and transfer.
Power Efficiency: Low power consumption for extended battery life in mobile devices.
Operating Voltage: Supports a range of operating voltages, making it suitable for various mobile platforms.
Package Type: Available in compact and space-saving packaging for integration into small form factor devices.

Application and Uses

The H5TQ1G63DFR-11C is ideal for applications requiring high-speed and power-efficient memory:

Mobile Devices: Used in smartphones, tablets, and portable consumer electronics for high-speed data storage and access.
Automotive Infotainment: Integrated into automotive entertainment and navigation systems for reliable and fast data processing.
Embedded Systems: Applied in IoT devices, industrial controllers, and smart appliances for efficient data handling.
Portable Gaming Consoles: Utilized in handheld gaming devices for seamless and responsive gaming experiences.

Equivalent Part

For similar functionalities, consider these alternatives to the H5TQ1G63DFR-11C:

MT47H64M16HR-25E: Mobile DDR SDRAM with high-speed performance and low power consumption for mobile and embedded applications.
IS43LD16128G-7BLI: Low-power DDR2 SDRAM offering efficient memory solutions for space-constrained systems.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Rohs Code	Yes	Part Life Cycle Code	Obsolete
Ihs Manufacturer	SK HYNIX INC	Part Package Code	BGA
Package Description	TFBGA, BGA96,9X16,32	Pin Count !	96
ECCN Code	EAR99	HTS Code !	8542.32.00.32
Access Mode !	MULTI BANK PAGE BURST	Access Time-Max	20 ns
Additional Feature !	AUTO/SELF REFRESH	Clock Frequency-Max (fCLK)	900 MHz
I/O Type	COMMON	Interleaved Burst Length	4,8
JESD-30 Code	R-PBGA-B96	JESD-609 Code	e1
Length	13 mm	Memory Density	1073741824 bit
Memory IC Type	DDR3 DRAM	Memory Width	16
Number of Functions	1	Number of Ports !	1
Number of Terminals	96	Number of Words	67108864 words
Number of Words Code	64000000	Operating Mode !	SYNCHRONOUS
Operating Temperature-Max	85 °C	Organization	64MX16
Output Characteristics	3-STATE	Package Body Material	PLASTIC/EPOXY
Package Code	TFBGA	Package Equivalence Code	BGA96,9X16,32
Package Shape	RECTANGULAR	Package Style	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)	260	Power Supplies !	1.5 V
Qualification Status !	Not Qualified	Refresh Cycles	8192
Seated Height-Max	1.2 mm	Self Refresh	YES
Sequential Burst Length	4,8	Standby Current-Max	0.01 A
Supply Current-Max	0.22 mA	Supply Voltage-Max (Vsup)	1.575 V
Supply Voltage-Min (Vsup)	1.425 V	Supply Voltage-Nom (Vsup)	1.5 V
Surface Mount !	YES	Technology	CMOS
Temperature Grade !	OTHER	Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form !	BALL	Terminal Pitch !	0.8 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	20
Width	7.5 mm