H5TC4G63CFR-RDI

Name: H5TC4G63CFR-RDI
Rating: 4.5 (10 reviews)
Author: Lisleapex

Next-generation memory solution with 256MB capacity, advanced CMOS design, and FBGA-96 pin configuration for reliable performance

6,635 Effective Inventory

H5TC4G63CFR-RDI

Effective Inventory6,635

Next-generation memory solution with 256MB capacity, advanced CMOS design, and FBGA-96 pin configuration for reliable performance

Manufacturer Part # : H5TC4G63CFR-RDI
Brand: Sk Hynix Inc
Product Categories : Memory

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

WireTransfer

Paypal

CreditCard

WesternUnion

MoneyGram

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

Example

Tape and Reel

Cut Tape

Tube or Tray

H5TC4G63CFR-RDI DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Interested Parts

HY57V641620FTP-7
Sk Hynix Inc
H5AN4G6NBJR-UHC
SK Hynix
Min$1.687

Price Dtls.
HY514400AJ-70
Sk Hynix Inc
H5TQ1G63DFR-11C
Sk Hynix Inc
H5TQ4G63CFR-RDI
Sk Hynix Inc
H5TQ4G63AFR-PBI
Sk Hynix Inc
H5TQ2G83GFR-RDC
SK Hynix Inc
H5TC2G83GFR-PBA
SK Hynix Inc

Rapid Quote

Please submit RFQ for H5TC4G63CFR-RDI or email to us: Email: [email protected], we will contact you in 12 hours.

Quantity^*

Contact Person^*

E-mail^*

Company Name

Anything else?

H5TC4G63CFR-RDI Description

The H5TC4G63CFR-RDI is a high-performance DRAM module from SK Hynix Inc, designed for reliable data storage and processing in various applications. This device features 256M x 16 bits of memory capacity, making it suitable for demanding systems that require large amounts of memory.

Features

The H5TC4G63CFR-RDI features:

256M x 16 bits of memory capacity
DDR3 SDRAM technology for high-speed data transfer
Low power consumption for efficient system operation
High-quality components and manufacturing process for reliable performance

Applications

The H5TC4G63CFR-RDI is suitable for various applications, including:

Server systems, data centers, and cloud computing environments.

Where to Use:

This module can be used in a variety of systems, such as:

Desktop computers
Laptops
Workstations
Server systems
Data centers
Cloud computing environments

Manufacturer

The H5TC4G63CFR-RDI is manufactured by SK Hynix Inc, a leading global semiconductor company.

Packages

The module is available in a variety of packages, including:

BGA (Ball Grid Array)
FBGA (Fine Pitch Ball Grid Array)
RGB (Row and Column Grid Array)

Equivalent Parts of H5TC4G63CFR-RDI

Micron MT41J256M8DH-125:A: A comparable DDR3 SDRAM module from Micron Technology, Inc.
Samsung K4B2G0846D-HC03: An alternative DDR3 SDRAM module from Samsung Electronics Co., Ltd.

FAQ

Q: What is the memory capacity of the H5TC4G63CFR-RDI?
A: The module has a memory capacity of 256M x 16 bits.

Q: Is the H5TC4G63CFR-RDI compatible with DDR3 SDRAM technology?
A: Yes, the module is designed to work with DDR3 SDRAM technology for high-speed data transfer.

Q: Can I use the H5TC4G63CFR-RDI in my server system or data center?
A: Yes, the module is suitable for various applications, including server systems and data centers.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Rohs Code	Yes	Part Life Cycle Code	Obsolete
Ihs Manufacturer	SK HYNIX INC	Package Description	TFBGA,
Reach Compliance Code	compliant	ECCN Code	EAR99
HTS Code !	8542.32.00.36	Access Mode !	MULTI BANK PAGE BURST
Additional Feature !	AUTO/SELF REFRESH	JESD-30 Code	R-PBGA-B96
Length	13 mm	Memory Density	4294967296 bit
Memory IC Type	DRAM MODULE	Memory Width	16
Number of Functions	1	Number of Ports !	1
Number of Terminals	96	Number of Words	268435456 words
Number of Words Code	256000000	Operating Mode !	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-40 °C
Organization	256MX16	Package Body Material	PLASTIC/EPOXY
Package Code	TFBGA	Package Shape	RECTANGULAR
Package Style	GRID ARRAY, THIN PROFILE, FINE PITCH	Peak Reflow Temperature (Cel)	260
Seated Height-Max	1.2 mm	Self Refresh	YES
Supply Voltage-Max (Vsup)	1.45 V	Supply Voltage-Min (Vsup)	1.283 V
Supply Voltage-Nom (Vsup)	1.35 V	Surface Mount !	YES
Technology	CMOS	Temperature Grade !	INDUSTRIAL
Terminal Form !	BALL	Terminal Pitch !	0.8 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	20
Width	7.5 mm