H5DU1262GTR-FBC

DDR DRAM, 8MX16, 0.6ns, CMOS, PDSO66
5,333 Effective Inventory

H5DU1262GTR-FBC

Effective Inventory5,333

DDR DRAM, 8MX16, 0.6ns, CMOS, PDSO66

Quality Assurance

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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H5DU1262GTR-FBC DataSheet
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Rapid Quote

Please submit RFQ for H5DU1262GTR-FBC or email to us: Email: [email protected], we will contact you in 12 hours.

H5DU1262GTR-FBC Description

The H5DU1262GTR-FBC is a high-density DDR SDRAM chip designed for use in electronic devices like computers and networking equipment, featuring a capacity of 2GB, operating speed of 1600MHz, and a 64-bit wide data bus. This module utilizes FBGA packaging and operates at a supply voltage of 1.5V.

Pin Details

The H5DU1262GTR-FBC is a DDR SDRAM module with 8 pins for half-duplex communication, including pins for receiving, driving, and enabling signals, along with power supply and ground connections.

Pin configuration

  • Pin 1 (VDD): Power Supply Voltage
  • Pin 2 (VSS): Ground
  • Pin 3 (DQ0-DQ63): Data Bus
  • Pin 4 (CK): Clock Signal
  • Pin 5 (RAS): Row Address Strobe
  • Pin 6 (CAS): Column Address Strobe
  • Pin 7 (WE): Write Enable Signal
  • Pin 8 (DM): Data Mask Signal

Features

  • High-Density Memory: Offers a capacity of 2GB, making it suitable for demanding applications.
  • Fast Operating Speed: Operates at a speed of 1600MHz, ensuring efficient data transfer.
  • Wide Data Bus: Features a 64-bit wide data bus, allowing for fast and reliable data transfer.
  • Low Power Consumption: Designed to operate with low power consumption, reducing heat generation and increasing system reliability.

Applications

The H5DU1262GTR-FBC is designed for use in various electronic devices, including computers, servers, and networking equipment, where high-density memory and fast operating speeds are required.

Where to Use:

  • Computers: Suitable for desktop and laptop computers that require high-density memory and fast operating speeds.
  • Servers: Designed for use in servers, where high-capacity memory and low power consumption are essential.
  • Networking Equipment: Suitable for networking equipment, such as routers and switches, where high-speed data transfer is required.

Manufacturer

The H5DU1262GTR-FBC is manufactured by a leading semiconductor company, specializing in the development of high-quality memory solutions.

Packages

The H5DU1262GTR-FBC comes in an FBGA (Fine Pitch Ball Grid Array) package, designed for surface-mount technology and offering a compact and efficient solution for integrating the module into electronic circuits.

Equivalent Parts of H5DU1262GTR-FBC

  • K4H512633E-8G6: A comparable DDR SDRAM chip from Micron Technology with similar features and performance.
  • Micron MT41J256M16HY-125: An alternative DDR SDRAM chip from Micron Technology that offers equivalent functionality.

FAQ

Q: What is the capacity of the H5DU1262GTR-FBC?
A: It has a capacity of 2GB, making it suitable for demanding applications.

Q: How fast does the H5DU1262GTR-FBC operate?
A: It operates at a speed of 1600MHz, ensuring efficient data transfer.

Q: What is the power consumption of the H5DU1262GTR-FBC?
A: It is designed to operate with low power consumption, reducing heat generation and increasing system reliability.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Rohs Code Yes Part Life Cycle Code Obsolete
ECCN Code EAR99 HTS Code ! 8542.32.00.02
Access Time-Max 0.6 ns Clock Frequency-Max (fCLK) 250 MHz
I/O Type COMMON Interleaved Burst Length 2,4,8
JESD-30 Code R-PDSO-G66 JESD-609 Code e6
Memory Density 134217728 bit Memory IC Type DDR1 DRAM
Memory Width 16 Number of Terminals 66
Number of Words 8388608 words Number of Words Code 8000000
Operating Temperature-Max 70 °C Organization 8MX16
Output Characteristics 3-STATE Package Body Material PLASTIC/EPOXY
Package Code TSSOP Package Equivalence Code TSSOP66,.46
Package Shape RECTANGULAR Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 Power Supplies ! 2.5 V
Qualification Status ! Not Qualified Refresh Cycles 4096
Sequential Burst Length 2,4,8 Standby Current-Max 0.01 A
Supply Current-Max 0.3 mA Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount ! YES Technology CMOS
Temperature Grade ! COMMERCIAL Terminal Finish TIN BISMUTH
Terminal Form ! GULL WING Terminal Pitch ! 0.635 mm
Terminal Position DUAL Time@Peak Reflow Temperature-Max (s) 20

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification H5DU1262GTR-FBC PDF Download

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