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H5AN8G8NAFR-UHC
DDR memory module with 1GB capacity and 8 chips in a 1x8 configuration
H5AN8G8NAFR-UHC
DDR memory module with 1GB capacity and 8 chips in a 1x8 configuration
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Manufacturer Part # : H5AN8G8NAFR-UHC
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Package/Case: BGA
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Brand: SK Hynix
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Product Categories : Controllers
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
Example
Tape and Reel
Cut Tape
Tube or Tray
H5AN8G8NAFR-UHC DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
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H5AN8G8NAFR-UHC Details
Features• Low Leakage• Low Zener Impedance• High Reliability
Key Features
- Low Leakage
- Low Zener Impedance
- High Reliability
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
| Rohs Code | Yes | Part Life Cycle Code | End Of Life |
| Reach Compliance Code | compliant | ECCN Code | EAR99 |
| HTS Code ! | 8542.32.00.36 | Access Mode ! | MULTI BANK PAGE BURST |
| Additional Feature ! | AUTO/SELF REFRESH | JESD-30 Code | R-PBGA-B78 |
| Length | 11 mm | Memory Density | 8589934592 bit |
| Memory IC Type | DDR DRAM | Memory Width | 8 |
| Number of Functions | 1 | Number of Ports ! | 1 |
| Number of Terminals | 78 | Number of Words | 1073741824 words |
| Number of Words Code | 1000000000 | Operating Mode ! | SYNCHRONOUS |
| Operating Temperature-Max | 85 °C | Operating Temperature-Min | |
| Organization | 1GX8 | Package Body Material | PLASTIC/EPOXY |
| Package Code | TFBGA | Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Seated Height-Max | 1.2 mm | Self Refresh | YES |
| Supply Voltage-Max (Vsup) | 1.26 V | Supply Voltage-Min (Vsup) | 1.14 V |
| Supply Voltage-Nom (Vsup) | 1.2 V | Surface Mount ! | YES |
| Technology | CMOS | Temperature Grade ! | OTHER |
| Terminal Form ! | BALL | Terminal Pitch ! | 0.8 mm |
| Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 7.5 mm |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
FAQs
What is H5AN8G8NAFR-UHC?
The H5AN8G8NAFR-UHC is a high-speed, low-power, multi-level cell (MLC) NAND flash memory device manufactured by SK hynix. It is designed for use in a wide range of applications such as solid-state drives (SSDs), embedded systems, and mobile devices.
How Does H5AN8G8NAFR-UHC Work?
The H5AN8G8NAFR-UHC works by storing data in memory cells that use multiple voltage levels to represent different digital states. When reading or writing data, the device utilizes a combination of voltage levels and sensing mechanisms to ensure accurate storage and retrieval of information. The high-speed and low-power characteristics make it suitable for demanding memory storage applications.
How Many Pins does H5AN8G8NAFR-UHC have and What are the Functions of the Pinout Configuration?
The H5AN8G8NAFR-UHC is housed in a specific package provided by SK hynix. The pinout configuration includes:
- VCC, VCCQ: Power supply pins for core and I/O, respectively.
- CE, RE, WE: Chip enable, read enable, and write enable control pins.
- R/B, CLE, ALE, WP: Ready/busy, command latch enable, address latch enable, and write protect pins.
- DATA[15:0]: 16-bit bidirectional data input/output pins.
- NC: No connection pin.
- RP, RV, RF: Internal NAND flash memory interface pins.
What are the Pros and Cons of H5AN8G8NAFR-UHC?
Pros:
- High-Speed Operation: Offers high-speed data transfer rates suitable for demanding applications.
- Low Power Consumption: Provides efficient power usage, making it suitable for battery-operated devices.
- Multi-Level Cell Technology: Utilizes MLC technology for higher data density and cost-effectiveness.
- Reliable Storage: Ensures reliable data storage and retrieval through advanced error correction mechanisms.
- Wide Application Compatibility: Suitable for a wide range of applications, including SSDs, embedded systems, and mobile devices.
Cons:
- Endurance Limitation: MLC NAND flash memory may have lower endurance compared to single-level cell (SLC) alternatives.
- Complex Controller Requirement: Requires a sophisticated controller to manage MLC NAND flash memory operations effectively.
- Write Endurance: MLC NAND flash may have a limitation on the number of write cycles compared to SLC NAND.
Are There Any Equivalents/Alternatives to H5AN8G8NAFR-UHC for Recommendation?
- The Toshiba TH58NVG7T2HBAFL0 is a similar high-speed, low-power MLC NAND flash memory device.
- Alternatives to the H5AN8G8NAFR-UHC include the Micron 5200 SATA series and the Intel 3D NAND SSDs.
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Price details
Prices listed do not include VAT.
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