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H5AN4G6NBJR-VKC
Compact and energy-efficient, this DDR SDRAM module is perfect for reducing power consumption without sacrificing performanc
H5AN4G6NBJR-VKC
Compact and energy-efficient, this DDR SDRAM module is perfect for reducing power consumption without sacrificing performanc
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
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H5AN4G6NBJR-VKC DataSheet
Pricing (USD)
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | $3.377 | $3.38 |
| 10 | $2.743 | $27.43 |
| 30 | $2.366 | $70.98 |
| 100 | $1.985 | $198.50 |
| 500 | $1.810 | $905.00 |
| 1000 | $1.729 | $1,729.00 |
These prices are subject to market fluctuations, and a quote submission is required to obtain the latest prices.
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H5AN4G6NBJR-VKC Details
Introduction to H5AN4G6NBJR-VKC
The H5AN4G6NBJR-VKC is a high-speed, low-power, CMOS double data rate type 3 (DDR3) SDRAM manufactured by SK Hynix. This IC is designed to provide high-speed and efficient memory access for applications such as computing, networking, and consumer electronics. With its large capacity and low power consumption, the H5AN4G6NBJR-VKC offers a reliable memory solution for demanding and power-sensitive electronic systems.
Specs and Features
- Memory Type: Double data rate type 3 (DDR3) SDRAM with high-speed data transfer.
- Capacity: 4 Gigabit (4G) capacity for storing a large volume of data and program instructions.
- Operating Frequency: Supports high-speed operation at specified clock rates for efficient data processing.
- Low Power Consumption: Designed for energy efficiency, reducing overall power consumption in electronic devices.
- Package Type: Available in compact and industry-standard packages for seamless integration onto PCBs.
- Temperature Range: Operates within a specified temperature range, suitable for various environmental conditions.
Application and Uses
The H5AN4G6NBJR-VKC is ideal for applications requiring high-speed and efficient memory access:
- Computer Systems: Used in desktops, laptops, and servers for fast data storage and retrieval in memory-intensive tasks.
- Networking Equipment: Integrated into routers, switches, and network appliances for buffering and caching data packets.
- Consumer Electronics: Applied in gaming consoles, high-definition televisions, and set-top boxes for reliable memory performance.
- Industrial Automation: Utilized in control systems and data acquisition devices for efficient data processing and storage.
Equivalent Part
For similar functionalities, consider these alternatives to the H5AN4G6NBJR-VKC:
- MT41K512M16HA-125: DDR3 SDRAM IC with high-speed operation and low power consumption for computing and embedded applications.
- NT5CC256M16DP-DI: DDR3L SDRAM IC offering low-voltage operation and high-density memory for mobile and portable devices.
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
| Part Life Cycle Code | Obsolete | Ihs Manufacturer | SK HYNIX INC |
| Package Description | TFBGA, | Reach Compliance Code | compliant |
| ECCN Code | EAR99 | HTS Code ! | 8542.32.00.36 |
| Access Mode ! | MULTI BANK PAGE BURST | Additional Feature ! | AUTO/SELF REFRESH |
| JESD-30 Code | R-PBGA-B96 | Length | 13 mm |
| Memory Density | 4294967296 bit | Memory IC Type | DDR4 DRAM |
| Memory Width | 16 | Number of Functions | 1 |
| Number of Ports ! | 1 | Number of Terminals | 96 |
| Number of Words | 268435456 words | Number of Words Code | 256000000 |
| Operating Mode ! | SYNCHRONOUS | Operating Temperature-Max | 95 °C |
| Organization | 256MX16 | Package Body Material | PLASTIC/EPOXY |
| Package Code | TFBGA | Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | 260 |
| Seated Height-Max | 1.2 mm | Self Refresh | YES |
| Supply Voltage-Max (Vsup) | 1.26 V | Supply Voltage-Min (Vsup) | 1.14 V |
| Supply Voltage-Nom (Vsup) | 1.2 V | Surface Mount ! | YES |
| Technology | CMOS | Temperature Grade ! | OTHER |
| Terminal Form ! | BALL | Terminal Pitch ! | 0.8 mm |
| Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | 20 |
| Width | 7.5 mm |
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Price details
Prices listed do not include VAT.
| Quantity | Unit Price |
|---|