H57V1262GTR-75C
H57V1262GTR-75C is a synchronous dynamic random-access memory (SDRAM) chip manufactured by HynixH57V1262GTR-75C
H57V1262GTR-75C is a synchronous dynamic random-access memory (SDRAM) chip manufactured by Hynix
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Shipping & Payment
Shipping & Payment
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
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H57V1262GTR-75C DataSheet
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H57V1262GTR-75C Details
H57V1262GTR-75C is a synchronous dynamic random-access memory (SDRAM) chip manufactured by Hynix. It offers 128Mb capacity, operates at a speed of 166MHz, and utilizes a 4-bank, 4K refresh architecture. The chip is organized in a 16Mx8 configuration and is designed for use in various electronic devices requiring high-speed memory.
Key Features
- 16Mb (1M x 16) CMOS DRAM
- Operating Voltage: 3.3V
- High speed: 75ns
- Low Voltage Operation
- Industrial Temperature Range: -40°C to +85°C
- Available in SOJ and TSOP packages
Application
- Smartphones
- Tablets
- Laptops
- Digital cameras
- Portable media players
- Automotive electronics
- Home appliances
- Medical devices
- Gaming consoles
- Industrial equipment
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Rohs Code | Yes | Part Life Cycle Code | Obsolete |
Part Package Code | TSOP2 | Pin Count ! | 54 |
Reach Compliance Code | ECCN Code | EAR99 | |
HTS Code ! | 8542.32.00.02 | Access Mode ! | FOUR BANK PAGE BURST |
Access Time-Max | 5.4 ns | Additional Feature ! | AUTO/SELF REFRESH |
Clock Frequency-Max (fCLK) | 133 MHz | I/O Type | COMMON |
Interleaved Burst Length | 1,2,4,8 | JESD-30 Code | R-PDSO-G54 |
JESD-609 Code | e6 | Length | 22.238 mm |
Memory Density | 134217728 bit | Memory IC Type | SYNCHRONOUS DRAM |
Memory Width | 16 | Number of Functions | 1 |
Number of Ports ! | 1 | Number of Terminals | 54 |
Number of Words | 8388608 words | Number of Words Code | 8000000 |
Operating Mode ! | SYNCHRONOUS | Operating Temperature-Max | 70 °C |
Operating Temperature-Min | Organization | 8MX16 | |
Output Characteristics | 3-STATE | Package Body Material | PLASTIC/EPOXY |
Package Code | TSOP2 | Package Equivalence Code | TSOP54,.46,32 |
Package Shape | RECTANGULAR | Package Style | SMALL OUTLINE, THIN PROFILE |
Peak Reflow Temperature (Cel) | 260 | Power Supplies ! | 3.3 V |
Qualification Status ! | Not Qualified | Refresh Cycles | 4096 |
Seated Height-Max | 1.194 mm | Self Refresh | YES |
Sequential Burst Length | 1,2,4,8,FP | Standby Current-Max | 0.002 A |
Supply Current-Max | 0.19 mA | Supply Voltage-Max (Vsup) | 3.6 V |
Supply Voltage-Min (Vsup) | 3 V | Supply Voltage-Nom (Vsup) | 3.3 V |
Surface Mount ! | YES | Technology | CMOS |
Temperature Grade ! | COMMERCIAL | Terminal Finish | Tin/Bismuth (Sn/Bi) |
Terminal Form ! | GULL WING | Terminal Pitch ! | 0.8 mm |
Terminal Position | DUAL | Time@Peak Reflow Temperature-Max (s) | 20 |
Width | 10.16 mm |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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Price details
Prices listed do not include VAT.
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