H27U1G8F2BTR-BC

Name: H27U1G8F2BTR-BC
Brand: SK Hynix
Rating: 4.5 (10 reviews)
Author: Lisleapex

H27U1G8F2BTR-BC is a NAND flash memory chip

7,580 Effective Inventory

H27U1G8F2BTR-BC

Effective Inventory7,580

H27U1G8F2BTR-BC is a NAND flash memory chip

Manufacturer Part # : H27U1G8F2BTR-BC
Package/Case: TSSOP-48
Brand: SK Hynix
Product Categories : Memory

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

WireTransfer

Paypal

CreditCard

WesternUnion

MoneyGram

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

Example

Tape and Reel

Cut Tape

Tube or Tray

H27U1G8F2BTR-BC DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Interested Parts

HY57V28820HCT-H
SK Hynix
HY6116ALP-10
SK Hynix
HY62256ALJ-10
SK Hynix
H57V1262GTR-75C
SK Hynix
HY62256ALP-10
SK Hynix
HY5DU121622CTP-D43
SK Hynix
HY57V641620HG
SK Hynix

Rapid Quote

Please submit RFQ for H27U1G8F2BTR-BC or email to us: Email: [email protected], we will contact you in 12 hours.

Quantity^*

Contact Person^*

E-mail^*

Company Name

Anything else?

H27U1G8F2BTR-BC Details

When it comes to mobile devices and embedded systems, the H27U1G8F2BTR-BC shines with its compact form factor and low power consumption. These features make it a key player in the world of portable electronics, offering designers the flexibility to create innovative products that deliver on both performance and efficiency. Whether you're designing a high-end smartphone or a cutting-edge tablet, this NAND flash memory chip has got you covered with its robust capabilities and reliable operation

Key Features

Advanced Wear-Leveling Technology
Fast Read/Write Operations Supported
Multiple Sector-Erase Capability

Application

Superior quality digital cameras
Precision in GPS devices
Seamless integration in portable media players

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Rohs Code	Yes	Part Life Cycle Code	Obsolete
Reach Compliance Code	compliant	ECCN Code	EAR99
HTS Code !	8542.32.00.51	Access Time-Max	20 ns
Command User Interface	YES	Data Polling	NO
JESD-30 Code	R-PDSO-G48	Memory Density	1073741824 bit
Memory IC Type	FLASH	Memory Width	8
Number of Sectors/Size	1K	Number of Terminals	48
Number of Words	134217728 words	Number of Words Code	128000000
Operating Temperature-Max	70 °C	Operating Temperature-Min
Organization	128MX8	Package Body Material	PLASTIC/EPOXY
Package Code	TSSOP	Package Equivalence Code	TSSOP48,.8,20
Package Shape	RECTANGULAR	Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Page Size	2K words	Parallel/Serial	PARALLEL
Power Supplies !	3/3.3 V	Qualification Status !	Not Qualified
Ready/Busy	YES	Sector Size	128K
Standby Current-Max	0.00005 A	Supply Current-Max	0.03 mA
Surface Mount !	YES	Technology	CMOS
Temperature Grade !	COMMERCIAL	Terminal Form !	GULL WING
Terminal Pitch !	0.5 mm	Terminal Position	DUAL
Toggle Bit	NO	Type	SLC NAND TYPE

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification H27U1G8F2BTR-BC PDF Download

FAQs

What is H27U1G8F2BTR-BC?

The H27U1G8F2BTR-BC is a NAND Flash memory chip manufactured by SK Hynix. It is commonly used in various electronic devices such as smartphones, tablets, solid-state drives, and embedded systems to store data and program instructions.

How Does H27U1G8F2BTR-BC Work?

The H27U1G8F2BTR-BC works by storing data in a non-volatile manner using NAND Flash memory cells. It uses a floating gate transistor structure to trap charge, allowing data to be retained even when the power is removed. The chip communicates with a controller or processor to read, write, and erase data as needed.

How Many Pins does H27U1G8F2BTR-BC have and What are the Functions of the Pinout Configuration?

The H27U1G8F2BTR-BC is typically housed in a TSOP (Thin Small Outline Package) or other packaging types with a specific pinout configuration. The exact pinout configuration may vary, but typical functions of the pins include:

VCC, VCCQ: Power supply pins for the core and I/O interface, respectively.
CE: Chip enable or control enable pin.
R/B: Ready/busy output pin for indicating the status of the memory chip.
WE, RE: Write enable and read enable pins for controlling data transfers.
IO0-IO7: I/O data pins for input and output operations.
ALE, CLE: Address latch enable and command latch enable pins for controlling address and command inputs.
WP: Write protect pin for hardware protection of write operations.

What are the Pros and Cons of H27U1G8F2BTR-BC?

Pros:

High Storage Capacity: Offers high-density storage for a wide range of applications.
Non-Volatile Memory: Retains data even when the power is turned off, suitable for mass storage.
Fast Access Time: Provides relatively fast read and write access compared to traditional mechanical storage devices.
Compact Form Factor: Compact package size enables integration into space-constrained designs.

Cons:

Endurance and Retention: NAND Flash memory cells have limited program/erase cycles and may require wear-leveling algorithms for extended use.
Complex Interface: Requires a controller or processor to manage data transfers and wear-leveling algorithms.
Data Integrity: May require error correction and bad block management for data reliability.
Performance Degradation: Speed and performance may degrade over time with extended use.

Are There Any Equivalents/Alternatives to H27U1G8F2BTR-BC for Recommendation?

Some equivalents or alternatives to the H27U1G8F2BTR-BC may include NAND Flash memory chips from other manufacturers such as Toshiba, Micron, or Samsung. Specific alternatives would depend on the exact requirements and specifications of the application.