H27U1G8F2BTR-BC

Name: H27U1G8F2BTR-BC
Brand: SK Hynix
Rating: 4.5 (10 reviews)
Author: Lisleapex

H27U1G8F2BTR-BC is a NAND flash memory chip

7,580 Effective Inventory

H27U1G8F2BTR-BC

Effective Inventory7,580

H27U1G8F2BTR-BC is a NAND flash memory chip

Manufacturer Part # : H27U1G8F2BTR-BC
Package/Case: TSSOP-48
Brand: SK Hynix
Product Categories : Memory

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

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About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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H27U1G8F2BTR-BC DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

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H27U1G8F2BTR-BC Description

The H27U1G8F2BTR-BC is a 1Gb density single-level cell (SLC) NAND Flash Memory chip from Hynix, designed for high-performance operation in a variety of applications. This device features a small outline package - 48-TSOP1 and offers advanced wear leveling for longer lifespan.

Features

Single-Level Cell (SLC) NAND Flash Memory: Enables reading and writing of data at high speeds.
1 Gb density: Offers a large storage capacity for storing various types of data.
3 V input voltage: Supports operation with low power supply and reduces the risk of errors due to voltage fluctuations.
High-speed synchronous double data rate interface: Enables fast and efficient data transfer between devices.
Advanced wear leveling: Helps extend the lifespan of the device by distributing write operations evenly across the flash memory cells.

Applications

The H27U1G8F2BTR-BC is commonly used in applications where high-performance, low power consumption, and reliability are essential, such as in embedded systems, automotive electronics, industrial control devices, and more.

Where to Use:

Multimedia devices
Solid-state drives (SSDs)
Embedded systems
Automotive electronics
Industrial control devices

Manufacturer

The H27U1G8F2BTR-BC is manufactured by Hynix, a leading producer of memory and storage solutions.

Packages

The H27U1G8F2BTR-BC comes in a small outline package - 48-TSOP1, designed for surface-mount technology, offering a compact solution for integrating the device into electronic circuits.

FAQ

Q: What is the capacity of the H27U1G8F2BTR-BC?
A: It has a 1Gb storage capacity, making it suitable for various applications where large amounts of data need to be stored or processed.

Q: Can the H27U1G8F2BTR-BC operate at high temperatures?
A: Yes, it is designed to operate within a wide temperature range, making it suitable for use in various environmental conditions.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Rohs Code	Yes	Part Life Cycle Code	Obsolete
Reach Compliance Code	compliant	ECCN Code	EAR99
HTS Code !	8542.32.00.51	Access Time-Max	20 ns
Command User Interface	YES	Data Polling	NO
JESD-30 Code	R-PDSO-G48	Memory Density	1073741824 bit
Memory IC Type	FLASH	Memory Width	8
Number of Sectors/Size	1K	Number of Terminals	48
Number of Words	134217728 words	Number of Words Code	128000000
Operating Temperature-Max	70 °C	Organization	128MX8
Package Body Material	PLASTIC/EPOXY	Package Code	TSSOP
Package Equivalence Code	TSSOP48,.8,20	Package Shape	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Page Size	2K words
Parallel/Serial	PARALLEL	Power Supplies !	3/3.3 V
Qualification Status !	Not Qualified	Ready/Busy	YES
Sector Size	128K	Standby Current-Max	0.00005 A
Supply Current-Max	0.03 mA	Surface Mount !	YES
Technology	CMOS	Temperature Grade !	COMMERCIAL
Terminal Form !	GULL WING	Terminal Pitch !	0.5 mm
Terminal Position	DUAL	Toggle Bit	NO
Type	SLC NAND TYPE

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification H27U1G8F2BTR-BC PDF Download

FAQs

What is H27U1G8F2BTR-BC?

The H27U1G8F2BTR-BC is a NAND Flash memory chip manufactured by SK Hynix. It is commonly used in various electronic devices such as smartphones, tablets, solid-state drives, and embedded systems to store data and program instructions.

How Does H27U1G8F2BTR-BC Work?

The H27U1G8F2BTR-BC works by storing data in a non-volatile manner using NAND Flash memory cells. It uses a floating gate transistor structure to trap charge, allowing data to be retained even when the power is removed. The chip communicates with a controller or processor to read, write, and erase data as needed.

How Many Pins does H27U1G8F2BTR-BC have and What are the Functions of the Pinout Configuration?

The H27U1G8F2BTR-BC is typically housed in a TSOP (Thin Small Outline Package) or other packaging types with a specific pinout configuration. The exact pinout configuration may vary, but typical functions of the pins include:

VCC, VCCQ: Power supply pins for the core and I/O interface, respectively.
CE: Chip enable or control enable pin.
R/B: Ready/busy output pin for indicating the status of the memory chip.
WE, RE: Write enable and read enable pins for controlling data transfers.
IO0-IO7: I/O data pins for input and output operations.
ALE, CLE: Address latch enable and command latch enable pins for controlling address and command inputs.
WP: Write protect pin for hardware protection of write operations.

What are the Pros and Cons of H27U1G8F2BTR-BC?

Pros:

High Storage Capacity: Offers high-density storage for a wide range of applications.
Non-Volatile Memory: Retains data even when the power is turned off, suitable for mass storage.
Fast Access Time: Provides relatively fast read and write access compared to traditional mechanical storage devices.
Compact Form Factor: Compact package size enables integration into space-constrained designs.

Cons:

Endurance and Retention: NAND Flash memory cells have limited program/erase cycles and may require wear-leveling algorithms for extended use.
Complex Interface: Requires a controller or processor to manage data transfers and wear-leveling algorithms.
Data Integrity: May require error correction and bad block management for data reliability.
Performance Degradation: Speed and performance may degrade over time with extended use.

Are There Any Equivalents/Alternatives to H27U1G8F2BTR-BC for Recommendation?

Some equivalents or alternatives to the H27U1G8F2BTR-BC may include NAND Flash memory chips from other manufacturers such as Toshiba, Micron, or Samsung. Specific alternatives would depend on the exact requirements and specifications of the application.

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