AM6251ATGGHAALW
Smart Interface Processor for Next-Gen HMAM6251ATGGHAALW
Smart Interface Processor for Next-Gen HM
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Manufacturer Part # : AM6251ATGGHAALW
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Package/Case: FCCSP (ALW)-425
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Brand: Texas Instruments
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.






Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
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AM6251ATGGHAALW DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Interested Parts
AM6251ATGGHAALW Details
Additionally, the AM6251ATGGHAALW boasts a 3-port Gigabit Ethernet switch with Time-Sensitive Networking (TSN) support, providing real-time communication capabilities essential for industrial and automotive applications. The inclusion of an additional PRU module enables real-time I/O capability, allowing for customization to suit specific use cases. With an extensive set of peripherals including USB, MMC/SD, Camera interface, OSPI, CAN-FD, and GPMC, the AM62x devices offer comprehensive system-level connectivity, further enhancing their suitability for a variety of applications
Key Features
Processor Cores:
- Up to Quad 64-bit Arm Cortex-A53 microprocessor subsystem at up to 1.4 GHz
- Quad-core Cortex-A53 cluster with 512KB L2 shared cache with SECDED ECC
- Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
- Single-core Arm® Cortex®-M4F MCU at up to 400 MHz
- 256KB SRAM with SECDED ECC
- Dedicated Device/Power Manager
Multimedia:
- Display subsystem
- Dual display support
- 1920x1080 @ 60fps for each display
- 1x 2048x1080 + 1x 1280x720
- Up to 165 MHz pixel clock support with Independent PLL for each display
- OLDI (4 lanes LVDS - 2x) and DPI (24-bit RGB LVCMOS)
- Support safety feature such as freeze frame detection and MISR data check
- 3D Graphics Processing Unit
- 1 pixel per clock or higher
- Fillrate greater than 500 Mpixels/sec
- >500 MTexels/s, >8 GFLOPs
- Supports at least 2 composition layers
- Supports up to 2048x1080 @60fps
- Supports ARGB32, RGB565 and YUV formats
- 2D graphics capable
- OpenGL ES 3.1, Vulkan 1.2
- One Camera Serial interface (CSI-Rx) - 4 Lane with DPHY
- MIPI CSI-2 v1.3 Compliant + MIPI D-PHY 1.2
- Support for 1,2,3 or 4 data lane mode up to 1.5Gbps
- ECC verification/correction with CRC check + ECC on RAM
- Virtual Channel support (up to 16)
- Ability to write stream data directly to DDR via DMA
Memory Subsystem:
- Up to 816KB of On-chip RAM
- 64KB of On-chip RAM (OCSRAM) with SECDED ECC , Can be divided into smaller banks in increments of 32KB for as many as 2 separate memory banks
- 256KB of On-chip RAM with SECDED ECC in SMS Subsystem
- 176KB of On-chip RAM with SECDED ECC in SMS Subsystem for TI security firmware
- 256KB of On-chip RAM with SECDED ECC in Cortex-M4F MCU subsystem
- 64KB of On-chip RAM with SECDED ECC in Device/Power Manager Subsystem
- DDR Subsystem (DDRSS)
- Supports LPDDR4, DDR4 memory types
- 16-Bit data bus with inline ECC
- Supports speeds up to 1600 MT/s
- Max addressable range
- 8GBytes with DDR4
- 4GBytes with LPDDR4
Functional Safety:
- Functional Safety-Compliant targeted [Industrial]
- Developed for functional safety applications
- Documentation will be available to aid IEC 61508 functional safety system design
- Systematic capability up to SIL 3 targeted
- Hardware Integrity up to SIL 2 targeted
- Safety-related certification
- IEC 61508 by TUV SUD planned
- Functional Safety-Compliant targeted [Automotive]
- Developed for functional safety applications
- Documentation will be available to aid ISO 26262 functional safety system design
- Systematic capability up to ASIL D targeted
- Hardware integrity up to ASIL B targeted
- Safety-related certification
- ISO 26262 by TUV SUD planned
- AEC - Q100 qualified
Security:
- Secure boot supported
- Hardware-enforced Root-of-Trust (RoT)
- Support to switch RoT via backup key
- Support for takeover protection, IP protection, and anti-roll back protection
- Trusted Execution Environment (TEE) supported
- Arm TrustZone based TEE
- Extensive firewall support for isolation
- Secure watchdog/timer/IPC
- Secure storage support
- Replay Protected Memory Block (RPMB) support
- Dedicated Security Controller with user programmable HSM core and dedicated security DMA & IPC subsystem for isolated processing
- Cryptographic acceleration supported
- Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
- Supports cryptographic cores
- AES – 128-/192-/256-Bit key sizes
- SHA2 – 224-/256-/384-/512-Bit key sizes
- DRBG with true random number generator
- PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
- Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
- Debugging security
- Secure software controlled debug access
- Security aware debugging
PRU Subsystem:
- Dual-core Programmable Real-Time Unit Subystem (PRUSS) running up to 333 MHz
- Intended for driving GPIO for cycle accurate protocols such as additional:
- General Purpose Input/Output (GPIO)
- UARTs
- I 2C
- External ADC
- 16KByte program memory per PRU with SECDED ECC
- 8KB data memory per PRU with SECDED ECC
- 32KB general purpose memory with SECDED ECC
- CRC32/16 HW accelerator
- Scratch PAD memory with 3 banks of 30 x 32-bit registers
- 1 Industrial 64-bit timer with 9 capture and 16 compare events, along with slow and fast compensation
- 1 interrupt controller (INTC), minimum of 64 input events supported
High-Speed Interfaces:
- Integrated Ethernet switch supporting (total 2 external ports)
- RMII(10/100) or RGMII (10/100/1000)
- IEEE1588 (Annex D, Annex E, Annex F with 802.1AS PTP)
- Clause 45 MDIO PHY management
- Packet Classifier based on ALE engine with 512 classifiers
- Priority based flow control
- Time sensitive networking (TSN) support
- Four CPU H/W interrupt Pacing
- IP/UDP/TCP checksum offload in hardware
- Two USB2.0 Ports
- Port configurable as USB host, USB peripheral, or USB Dual-Role Device (DRD mode)
- Integrated USB VBUS detection
- Trace over USB supported
General Connectivity:
- 9x Universal Asynchronous Receiver-Transmitters (UART)
- 5x Serial Peripheral Interface (SPI) controllers
- 6x Inter-Integrated Circuit (I 2C) ports
- 3x Multichannel Audio Serial Ports (McASP)
- Transmit and Receive Clocks up to 50 MHz
- Up to 16/10/6 Serial Data Pins across 3x McASP with Independent TX and RX Clocks
- Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
- Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
- FIFO Buffers for Transmit and Receive (256 Bytes)
- Support for audio reference output clock
- 3x enhanced PWM modules (ePWM)
- 3x enhanced Quadrature Encoder Pulse modules (eQEP)
- 3x enhanced Capture modules (eCAP)
- General-Purpose I/O (GPIO), All LVCMOS I/O can be configured as GPIO
- 3x Controller Area Network (CAN) modules with CAN-FD support
- Conforms w/ CAN Protocol 2.0 A, B and ISO 11898-1
- Full CAN FD support (up to 64 data bytes)
- Parity/ECC check for Message RAM
- Speed up to 8Mbps
Media and Data Storage:
- 3x Multi-Media Card/Secure Digital (MMC/SD) interface
- 1x 8-bit eMMC interface up to HS200 speed
- 2x 4-bit SD/SDIO interface up to UHS-I
- Compliant with eMMC 5.1, SD 3.0 and SDIO Version 3.0
- 1× General-Purpose Memory Controller (GPMC) up to 133 MHz
- Flexible 8- and 16-Bit Asynchronous Memory Interface With up to four Chip (22-bit address) Selects (NAND, NOR, Muxed-NOR, and SRAM)
- Uses BCH Code to Support 4-, 8-, or 16-Bit ECC
- Uses Hamming Code to Support 1-Bit ECC
- Error Locator Module (ELM)
- Used With the GPMC to Locate Addresses of Data Errors From Syndrome Polynomials Generated Using a BCH Algorithm
- Supports 4-, 8-, and 16-Bit Per 512-Byte Block Error Location Based on BCH Algorithms
- OSPI/QSPI with DDR / SDR support
- Support for Serial NAND and Serial NOR flash devices
- 4GBytes memory address support
- XIP mode with optional on-the-fly encryption
Power Management:
- Low power modes supported by Device/Power Manager
- Partial IO support for CAN/GPIO/UART wakeup
- DeepSleep
- MCU Only
- Standby
- Dynamic frequency scaling for Cortex-A53
Optimal Power Management Solution:
- Recommended TPS65219 Power Management ICs (PMIC)
- Companion PMIC specially designed to meet device power supply requirements
- Flexible mapping and factory programmed configurations to support different use cases
Boot Options:
- UART
- I 2C EEPROM
- OSPI/QSPI Flash
- GPMC NOR/NAND Flash
- Serial NAND Flash
- SD Card
- eMMC
- USB (host) boot from Mass Storage device
- USB (device) boot from external host (DFU mode)
- Ethernet
Technology / Package:
- 16-nm technology
- 13 mm x 13 mm, 0.5-mm pitch, 425-pin FCCSP BGA (ALW)
- 17.2 mm x 17.2 mm, 0.8-mm pitch, 441-pin FCBGA (AMC)
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Arm CPU | 1 Arm Cortex-A53, 2 Arm Cortex-A53, 4 Arm Cortex-A53 | Arm (max) (MHz) | 1400 |
Coprocessors | 1 Arm Cortex-M4F, GPU | CPU | 64-bit |
Graphics acceleration | 1 3D | Display type | MIPI DPI, OLDI |
Protocols | Ethernet, TSN | Ethernet MAC | 2-Port 10/100/1000 |
Hardware accelerators | PRU-SS | Features | General purpose |
Operating system | Android, Linux | Security | Secure boot |
Rating | Catalog | Power supply solution | TPS65219 |
Operating temperature range (°C) | -40 to 105 |
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