88AP270MA2-BHE1C520

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Risc Microprocessor, 520MHZ, Cmos, PBGA360, 23 X 23 Mm, 1 Mm Pitch, Rohs Compliant, Plastic, BGA-360

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Service & Packaging

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88AP270MA2-BHE1C520 DataSheet

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88AP270MA2-BHE1C520 Description

The 88AP270MA2-BHE1C520 is a high-performance system-on-chip (SoC) designed for use in various applications, featuring dual-core ARM Cortex-A9 processor, integrated PowerVR SGX540 graphics, and support for full HD video playback. This device is ideal for smartphones, tablets, and other portable devices that require low power consumption and advanced connectivity options.

Pin Details

The 88AP270MA2-BHE1C520 is a highly integrated SoC with multiple pins for various functions, including:

  • Pin configuration
    • Pin 1 (RO): Receiver Output
    • Pin 2 (RE): Receiver Output Enable
    • Pin 3 (DE): Driver Output Enable
    • Pin 4 (DI): Driver Input
    • Pin 5 (GND): Ground
    • Pin 6 (A): Non-inverting Receiver Input/Driver Output
    • Pin 7 (B): Inverting Receiver Input/Driver Output
    • Pin 8 (VCC): Positive Power Supply

Features

  • Dual-core ARM Cortex-A9 processor: Provides high-performance processing capabilities for demanding applications.
  • Integrated PowerVR SGX540 graphics: Enables smooth and efficient video playback, gaming, and other graphics-intensive tasks.
  • Support for full HD video playback: Allows for high-quality video streaming and playback on devices.
  • Low power consumption: Designed to minimize power usage while maintaining performance, making it suitable for battery-powered devices.

Applications

This SoC is designed for use in various applications, including smartphones, tablets, and other portable devices that require high-performance processing, advanced graphics capabilities, and low power consumption.

Where to Use:

  • Smartphones: Ideal for high-end smartphones that require advanced processing and graphics capabilities.
  • Tablets: Suitable for tablets that need powerful processing and graphics capabilities for gaming, video playback, and other demanding tasks.
  • Portable devices: Designed for use in various portable devices that require low power consumption and high-performance processing.

Manufacturer

The 88AP270MA2-BHE1C520 is manufactured by Apple Inc., a leading technology company known for its innovative products and services.

Packages

This SoC comes in various packages, including:

  • BBGA (Ball Grid Array): A popular package type used in many electronic devices.
  • CSP (Chip Scale Package): A compact package that minimizes the device's footprint.

Equivalent Parts of 88AP270MA2-BHE1C520

  • A9-SoC: A comparable system-on-chip (SoC) designed for use in various applications, including smartphones and tablets.
  • PowerVR SGX540: An alternative graphics processing unit (GPU) that provides similar performance capabilities to the PowerVR SGX540.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Manufacturer Marvell Product Category ! IC Chips

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification 88AP270MA2-BHE1C520 PDF Download

FAQs

What is 88AP270MA2-BHE1C520?

The 88AP270MA2-BHE1C520 is a system-on-chip (SoC) solution developed by Marvell. It is designed for use in high-performance embedded applications such as network storage, IoT gateways, and industrial automation.

How Does 88AP270MA2-BHE1C520 Work?

The 88AP270MA2-BHE1C520 integrates a powerful ARM CPU, hardware acceleration engines, and various I/O interfaces to provide a comprehensive computing and connectivity solution. It is designed to handle complex networking and storage tasks with high performance and efficiency.

How Many Pins does 88AP270MA2-BHE1C520 have and What are the Functions of the Pinout Configuration?

The 88AP270MA2-BHE1C520 is available in a BGA (Ball Grid Array) package with a specific pin-out configuration that includes various digital and analog input/output pins, power supply pins, and configuration pins.

What are the Pros and Cons of 88AP270MA2-BHE1C520?

Pros:

  • High Performance: Provides powerful processing capabilities suitable for demanding applications.
  • Integration: Integrates multiple functionalities into a single chip, reducing external component count and simplifying system design.
  • Connectivity: Offers a range of I/O interfaces for versatile connectivity options.
  • Efficiency: Optimized for power efficiency, making it suitable for embedded and IoT applications.

Cons:

  • Complexity: Requires specific expertise for optimal configuration and utilization of all its features.
  • Cost: May have a higher cost compared to simpler microcontroller or microprocessor solutions.
  • Software Development: Requires software development for leveraging its performance and features.

Are There Any Equivalents/Alternatives to 88AP270MA2-BHE1C520 for Recommendation?

Other similar SoC solutions to consider include the NXP i.MX 6 series and the Qualcomm Snapdragon series for high-performance embedded applications.

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