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VBGA-132 Related Product
| Part Number | Description | Brand | Lifecycle Status | Cargo cycle | In Stock | Operation |
|---|---|---|---|---|---|---|
| MT29F256G08CECEBJ4-37ITR:E | High-density, high-performance MLC NAND flash memory for data storage and processin | Micron | 3~7 Days | 3,555 | ||
| MT29F2T08EMHBFJ4-R:B | High-performance memory for demanding applications, featuring B capacity and advanced QDP desig | Micron | 3~7 Days | 7,487 | ||
| MT29F1T08EELCEJ4-R:C | 3D NAND Flash Memory - Product MT29F1T08EELCEJ4-R:C | Micron | 3~7 Days | 6,668 | ||
| MT29F512G08EBHBFJ4-T:B | Ultra-high-capacity, ultra-low-latency NAND for AI, big data, and IoT edge processing | Micron | 3~7 Days | 5,825 | ||
| MT29F2T08EMHAFJ4-3ITF:A | TLC NAND flash memory module with 256GB capacity and 8-bit I/O configuration | Micron | 3~7 Days | 2,919 | ||
| MT29F2T08EMLCEJ4-R:C | 2TB NAND Flash Storage Device | Micron | 3~7 Days | 6,363 | ||
| MT29F2T08EMHBFJ4-T:B | NAND Flash TLC 2 Terabytes 256 Gigabits x8 FBGA Quad-Die Package | Micron | 3~7 Days | 6,292 | ||
| MT29F384G08EBCBBJ4-37:B | TLC NAND Flash Memory with Parallel/Serial Interface, operating at 3 | Micron | 3~7 Days | 2,850 | ||
| MT29F32G08ABCDBJ4-6IT:D | MT29F32G08ABCDBJ4-6IT:D is compliant with ROHS regulations | Micron | 3~7 Days | 3,062 | ||
| MT29F1T208ECCBBJ4-37:B | MT29F1T208ECCBBJ4-37:B is a NAND memory integrated circuit with a capacity of 1 | Micron | 3~7 Days | 3,655 | ||
| MT29F512G08CECBBJ4-37:B | Compact 132-Pin VBGA package with high-speed parallel and serial interfaces available | Micron | 3~7 Days | 4,326 | ||
| MT29F768G08EECBBJ4-37:B | 768Gbit NAND Flash Memory IC with parallel interface clocked at 267 MHz, contained within a 132-VBGA package sized 12x18 | Micron | 3~7 Days | 5,193 |
Additional Package/Case