TSOP66 Related Product
Part Number | Description | Brand | Lifecycle Status | Cargo cycle | In Stock | Operation |
---|---|---|---|---|---|---|
K4H561638N-LCCC | The K4H561638N-LCCC is a dynamic random-access memory (DRAM) chip commonly used in electronic devices for data storage and retrieval | Samsung Electro-Mechanics | 3~7 Days | 3,297 | ||
HY5DU121622CTP-J | -66, 0.65 PITCH | SK Hynix | 3~7 Days | 5,130 | ||
HY5DU121622CTP-D43 | DDR DRAM, 32MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 PITCH, ROHS COMPLIANT, TSOP2-66 | SK Hynix | 3~7 Days | 6,432 | ||
HY5DU281622ET-J | DDR DRAM, 8MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 | SK Hynix | 3~7 Days | 5,212 | ||
HY5DU121622DTP-J | With a pitch of 0.65mm and ROHS compliance, this TSOP2-66 memory chip is ideal for environmentally-conscious projects | SK Hynix | 3~7 Days | 6,593 | ||
H5DU5162ETR-E3C | Strictly for authorized manufacturers and contractors | SK Hynix | 3~7 Days | 6,611 | ||
MT46V16M16P-5B:K | DDR DRAM 16MX16 0.7ns CMOS PDSO66 0.40 INCH LEAD FREE PLASTIC TSOP-66 | Micron | 3~7 Days | 6,588 | ||
K4H511638J-LCB3 | Ddr Dram, 32MX16, 0.7NS, Cmos, PDSO66 | Samsung Electro-Mechanics | 3~7 Days | 7,343 | ||
W9412G6JH-5 | DDR DRAM, 8MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, ROHS COMPLIANT, TSOP2-66 | Winbond Electronics | 3~7 Days | 7,909 | ||
HY5DU561622FTP-4 | DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 | SK Hynix | 3~7 Days | 6,205 | ||
HY5DU561622ETP-4 | DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, LEAD FREE, TSOP2-66 | SK Hynix | 3~7 Days | 3,935 | ||
H5DU5182ETR-E3C | DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 | SK Hynix | 3~7 Days | 6,127 | ||
H5DU1262GTR-E3C | DDR DRAM with 8MX16 capacity and 0.7ns speed | SK Hynix | 3~7 Days | 7,585 | ||
H5DU2562GTR-E3C | DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 | SKHYNIX | 3~7 Days | 5,483 | ||
K4D261638E-TC40 | DDR DRAM, 8MX16, 0.6ns, CMOS, PDSO66, TSOP2-66 | Samsung Electro-Mechanics | 3~7 Days | 7,007 | ||
HY5DU56822DT-D43 | DDR DRAM, 32MX8, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 | SK Hynix | 3~7 Days | 3,617 | ||
HY5DU56822BT-D43 | 32MX8 DDR DRAM with 0.7ns access speed | SK Hynix | 3~7 Days | 3,317 | ||
MT46V64M8P-5B | DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 | Micron | 3~7 Days | 6,214 | ||
W9425G6JH-5 | DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, ROHS COMPLIANT, TSOP2-66 | Winbond Electronics | 3~7 Days | 3,083 | ||
W9425G6JH-4 | DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, ROHS COMPLIANT, TSOP2-66 | Macronix | 3~7 Days | 4,661 | ||
MT46V16M16P-5B | DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 | Micron | 3~7 Days | 4,342 | ||
M13S2561616A-5TG | A high-performance DRAM module for advanced memory needs: 'M13S25616A-5TG | Elite Semiconductor Memory Technology Inc | 3~7 Days | 7,947 | ||
NT5DS32M16ES-5T | NT5DS32M16ES-5T is a DDR1 memory module with a capacity of 512Mb and a speed of 200MHz, featuring a 32Mx16 configuration in a TSOP66 package | Nanya Technology | OBSOLETE | 3~7 Days | 6,917 | |
EM6AA160TSA-5G | High-performance chip for data-intensive systems | Etron Technology Inc | 3~7 Days | 7,791 |
Additional Package/Case